"Compound semiconductor chip ceramic metallization technology" passed the evaluation of scientific and technological achievements

Article source: China Net Science Channel On December 27, the Evaluation Conference of the China High-Tech Industrialization Research Association was held in Beijing.
The conference strictly followed the relevant provisions of the "Science and Technology Evaluation Measures" of the Ministry of Science and Technology, and strictly followed the standards and procedures for the evaluation of scientific and technological achievements.
Based on the principles of science, independence, objectivity and fairness, the scientific and technological achievements of the "Compound Semiconductor Chip Ceramic Metallization Technology" project developed by Soth Electronic Packaging Materials Co.
, Ltd.
in Shanwei City, Guangdong Province were evaluated.
? The evaluation meeting is composed of relevant officials and industry experts from the National Development and Reform Commission, the Ministry of Science and Technology, the Ministry of Industry and Information Technology, the Ministry of Housing and Urban-Rural Development, the Institute of Microelectronics of the Chinese Academy of Sciences, and the China Academy of Aerospace Electronics Technology.
?? After listening to the technical summary report of the project completion unit and reviewing the evaluation data, the evaluation committee believes that the data provided by the project is basically complete and meets the evaluation requirements.
According to the inspection by a third-party authority, its performance indicators meet the relevant standards Claim.
"Increase investment in science and technology, promote high-quality development of enterprises, and solve the long-standing problem of high-end packaging materials being restricted by others.
" Lin Yaowei, chairman of Soth Electronic Packaging Materials Co.
, Ltd.
, Shanwei City, Guangdong Province, said, 5G, artificial intelligence, Internet of Things The main technical difficulties of the "new infrastructure" represented by the likes are various chips and their packaging technologies.
For the first time, Solus has organically combined the packaging materials, ceramic metallization, and ceramic-metal (glass) packaging processes to solve the problems of thermal matching, insulation and sealing, and improve the performance stability and life of third-generation compound semiconductor chips.
, Realize the domestic substitution of packaging materials in all directions.
After the evaluation by the expert evaluation committee, the technology of the project has reached the domestic leading level.
It was agreed that the "compound semiconductor chip ceramic metallization technology" passed the evaluation of scientific and technological achievements, and said that the technology has studied gold-based (gold tin, gold silicon, gold germanium and Gold gallium) hot calendering technology has realized domestic substitution, effectively solving the problems of foreign import dependence, long supply cycle and high cost; at the same time, high vacuum ion beam assisted evaporation, magnetron sputtering and other technologies have been optimized.
Ceramic metallization has realized localized substitution and effectively solved technical problems such as unstable quality of domestic products; and preliminary researched and developed a series of packaging materials and technologies in the temperature range of 280-460℃, which can be used for high-end functional chips of compound semiconductors and high-performance sensors, etc.
Package.
According to the data, Shanwei South Electronic Packaging Materials Co.
, Ltd.
of Guangdong Province is a national high-tech enterprise, and currently has 9 authorized patents, including 2 invention patents and 7 utility model patents; 14 patents have been accepted, including 12 invention patents and 2 utility model patents.
In addition, the "Preformed Solder Sheet Product Standard" formulated by it is also the industry standard of Guangdong Province.