Crystal EMC: Epoxy "good" application

China Coatings Online News Information:
Lighting Hope Star - Crystal Electronics EMC series of products. Crystal Electronics is actively involved in EMC product development. Drawing on the mature mass production of ceramic products - easy series process, successfully completed EMC 3014, EMC 2835 and EMC 3030 mass production work, has now achieved mass delivery. EMC 3020 and EMC 3535 are in development. Haitz's law, which is the driving force behind the development of technology in the LED industry, is constantly being confirmed, indicating that LED prices will become 1/10 every 10 years and performance will increase 20 times. The development of LEDs has also validated the law, and even the rate of price/performance improvement exceeds the prediction of this law. In 2013, LED lighting has become a new engine for the LED industry and will surpass the backlight market. In order to pry the huge lighting market, so that LED lighting products in ordinary people's homes bright bloom, the major LED companies make every effort to solve the number, technology-driven as the core to jointly promote the rapid development of the LED industry. LED light source as the core of LED lighting products, over the years has made considerable progress. However, the development of LED light sources and packaging accessories, including LED brackets, solid crystal adhesive, phosphor and powder adhesive, each packaging of raw materials innovation, will trigger a revolution in the field of LED light sources.
with the development of the industry, LED products photoelectring efficiency has exceeded most of the traditional lighting sources, LED practitioners gradually shifted their attention from lm/W to lm/$, cost-effective to become the core competitiveness of LED. Table stickers (SMDs) are packaged in the market. The series is widely supported by customers for their small size, suited for mass production, cost-effective, and compatible with mature surface mounting processes (SMTs). Products in the form of SMD packages are also evolving with the progress of bracket materials. The input power and luminous intensity of a single package device are constantly increasing, and the heat resistance of the material is becoming more and more demanding. As the market demands more and more lm/$indicators, the direction of lm/$increase falls on the chip's high current density drive, which is used in small package devices to reduce material costs for a single package. In this large context, the early PA6T, PA9T and PCT bracket plastic materials can no longer meet the high-quality requirements of LED, so EMC (Epoxy Molding Compound) packaging materials to the stage of LED application history. EMC Chinese called epoxy plastic, also known as epoxy mold plastic, is one of the main raw materials in IC packaging manufacturing. With the development of IC packaging technology, EMC as a major electronic packaging material has also been rapidly developed.
EMC occupies more than 97% of the market for microelectronic packaging materials with its high reliability, low cost, simple production process and suitable for large-scale production. Today, EMC extends its reach to semiconductor devices, integrated circuits, consumer electronics, automotive, military, aerospace, and more. EMC offers excellent solutions for LED packaging applications due to its superior heat resistance and suitability for large-scale modern production. EMC is a highly integrated frame form with modified Epoxy materials and etching technology in the Molding equipment package, etching the copper substrate so that Epoxy has a greater contact area with the copper substrate support, and relative to PPA and other thermoplastic plastic EMC itself has a strong bonding force, making EMC products in moisture and red ink penetration advantages, the package form originated from the package IC, but different from the IC package. According to
China Coatings Onlineexperts
, due to changes in materials and structure, EMC products with high heat resistance, anti-UV, high integration, subject to large currents, small size and other significant features. In particular, the significant improvement in anti-UV performance, so that EMC product applications greatly expanded, can cope with outdoor lighting and automotive lighting and other humid environments, will be mature high-end ceramic packaging products to form a favorable impact.
ICs do not take light into account, with mechanical protection and air tightness as the goal, and therefore mostly black EMC plastics, but EMC in LED packaging must consider higher light efficiency, EMC must be light absorption, high reflectivity of white plastic. As a brand-new plastic material its research and development difficult, resulting in the EMC material is currently only mastered in Foundachi and a few technical strength of the international materials factory, the above-mentioned companies hold EMC materials and packaging patents, the latest in the patent barriers, in the short term can not achieve a breakthrough in technology and the market, so EMC materials sell at a higher price. The realized mass production of Hitachi EMC material price is about PA9T TA112 plastic 8 to 9 times, and EMC bracket using etching process, its cost is 3 to 5 times the stamping process, so EMC bracket generally high unit price, packaging finished products are also higher than the traditional use of PPA and PCT plastic bracket finished products. However, EMC's lower Epoxy expansion coefficient makes it possible to use supercurrents. THE EMC 3014 has passed 150mA reliability tests, power drive to 0.5W, and EMC 3030 package drives from 350mA to 600mA, with power ranges from 1W to 2W, in internal reliability enterprise testing. Although the unit price is higher, it drives to higher power, making it easy for EMC products to achieve higher lm/$values. As a packaging practitioner, Crystal Electronics has always followed the cutting-edge packaging materials and advanced packaging technology as its own responsibility, and actively invested in EMC product development.
, drawing on the mature mass production of ceramic products - easy series process, successfully completed EMC 3014, EMC 2835 and EMC 3030 mass production work, has achieved mass delivery. EMC 3020 and EMC 3535 are in development. EMC is highly regarded for its high heat resistance, in pursuit of cost-effective, in the LED industry has become a consensus in the use of supercurrent, but ultracurrent use is also a risk and opportunity, the greatest risk is heat treatment. At present, the industry EMC universal packaging process is: the use of positive /vertical structure, small power chip, low thermal insulation glue as chip adhesive, and then welding wire, powder, cutting to achieve finished production. At present, LED chip adhesive roughly has transparent insulation glue, white glue and silver glue three categories, the three thermal conductivity is 0.2W / (m.K), 0.6 to 0.9 W / (m.K) and 25 to 30 W / (m.K), silver glue although the thermal conductivity is superior, but light absorption is serious, packaging finished light pass is low, comprehensive consideration of low thermal insulation for the best solution. Although the insulation glue is silicone-based material, but when EMC products overcurrent drive (power greater than 1W is particularly obvious), the solid crystal layer temperature usually exceeds the insulation glue Tg temperature, long-term use of insulation adhesive layer will appear yellowing, blacking and other serious quality problems.
electronics is not only a packaging company, but also LED chip company, the company's reverse welding chip technology is well-known in the industry. Based on the inverted process of ceramic products - Easy Star has been LED streetlights and indoor lighting shine, flash as a flash has emerged in the domestic well-known smartphones. Today, Jingke Electronics has taken a step further, continuous technological innovation, research and development with independent core technology, with differentiated competition EMC series of products. Based on the latest DA chip technology of crystalline electronics, the series is properly routed on the copper substrate of EMC bracket, and the interconnection of LED chip and EMC bracket is realized through the cocrystalline process. The series of EMC 3030 products for the cutting-edge, conceptual products, is currently in the research and development, experimental stage, the chip through conductive metal and bracket copper substrate connected, the chip adhesive layer thermal conductivity of more than 100 times transparent insulation layer, completely get rid of the supercurrent use of poor thermal distress. Based on the advanced chip and packaging technology of Crystal Electronics, the EMC 3030 can easily achieve 2W drive power, good product reliability, bracket matching higher heat-resistant reflective materials such as SMC (Silicon Molding Compound), can achieve 2 to 3W ultra-high power use.
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