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    Home > Coatings News > Paints and Coatings Market > How hot is the silicone modified bisphenol EP?

    How hot is the silicone modified bisphenol EP?

    • Last Update: 2021-01-05
    • Source: Internet
    • Author: User
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    China Coatings Online News Information:
    silicone modified BPA F epoxy resin thermal performance research, many researchers have been advancing. The School of Aerospace and Materials Engineering, National Defense University of Science and Technology, recently studied the thermal properties of phenolic hydroxyl-based organic alkyl silane, and 3,3', 3" -trihydroxyxane trisulphate glyceline ether, and a variety of self-designed and synthesized silicone modifiers, modified bisphenol F epoxy resins. The results show that silicone can reduce the line expansion coefficient of modified resin, but the addition of end epoxy-based adipose polysilicon and phenolic hydroxyl-containing biscepose makes the glass temperature of cured matter decrease by more than 10 degrees C; The addition of oxygen-based silane triple-shrinking glycelin ether can reduce the line expansion coefficient by about 20%, the internal stress index by about 20%, the anti-cracking index by more than 50%, the curing glass temperature is basically unchanged, the thermal decomposition temperature has been greatly improved, is an ideal epoxy resin toughener, can be used in electronic packaging and other industries with epoxy resin modifier. According to
    China Coatings Onlineexperts
    introduced, silicone has good thermal stability, low surface energy, low gentle toughness, weather resistance, water repugnant, as well as good oxidation resistance, high dielem strength advantages, silicone modified epoxy resin is developed in recent years, both to reduce the stress in epoxy resin, but also to increase the effective way of epoxy resin toughness.
    However, due to the low surface energy of silicone, and epoxy resin there is compatibility problem, in addition to silicone carbon oxide bond softness is good, polymer glassing temperature is low, its modified epoxy resin is often accompanied by a decrease in heat resistance, can not make strength, toughness and heat resistance at the same time increase. Yil-gor Emel and others studied reactive polydymethane polymer-modified epoxy resins and found that even though the molecular mass of polydymethane polymers is low (molecular mass is 500 or only 5 -Si-O-repeat units), the compatibness of the two is still not ideal. With 1,3-double-ammonia polymethane as a model curing agent and modifier of epoxy resin, the expected stretch strength and impact strength were improved, but with the increase of silicon content, the glucification temperature decreased by a larger margin, and the glassing temperature of the modified system was reported in more studies. In this study, from the perspective of changing the structure of the cross-linking network, the thermal properties of modified bisphenol F epoxy resin were studied by designing and synthesized a new silicone modifier replaced by epoxy-based adipose family silicones, hydroxyl-containing and epoxy-based benzene-based. The raw materials used in the experimental part are - Bisphenol F epoxy resin: Sichuan Tingjiang Technology Co., Ltd., epoxy value 0.51eq/100g, viscosity 300 to 4000mPa-s (25 degrees C); Phenol hydroxyl secondary energy silicon modifier, homemade; ecyclic polypolysed silicon modifier containing epoxy, epoxy value 0.52 to 0.58eq/100g homemade (piloted).
    analysis test includes the following contents: First, the gling temperature of curing material and the determination of line expansion coefficient, the glass temperature of the thermostat resin is tested by TMA method. Japanese science TASl00 thermal analyzer, scanning temperature range from room temperature to 200 degrees C, air atmosphere, sample size 5mm×20mm, heating rate of 10%/min, thermal expansion curve inflection point corresponding to the temperature of the sample glass transition temperature (Tg). Second, thermal weight loss performance test, TA-2400 type differential scanning volume heat meter, static air, heating rate of 5 degrees C/min. Third, micromorphological analysis of resin curing, JEOL JSM-560LV scanning electron microscope. The experts discussed the molecular structure of the new organic alkaloxysilane, the effects of end-oxydisilane, phenolic hydroxyl-containing dual-phenolic silicones, the liquid polyfunctal silicones containing epoxy, the study of the thermal properties of silicone-modified bisphenol F epoxy resins, the effects of silicone modifiers on Tg, and the effects of silicone modifiers on curing line coefficients. From the analysis of the performance results of the silicone modified epoxy resin synthesized above, the following conclusions can be drawn: the addition of ethylene oxide-based polyoxysilane at the end of the adipose family and the addition of phenol hydroxyl-containing ethylene oxide oxygen-based silane make the glassing temperature of the cured substance decrease by different degrees. The introduction of more rigid phenol hydroxyl in silicone molecules did not improve the reduction of the glass temperature of modified substances, which may be related to the curing reaction of phenolic hydroxyl involved in epoxy resin, affecting the full curing of bisamine.
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