Introduction to the development and innovation of laser displacement sensing technology

There are many technologies that can achieve accurate optical displacement measurement, and industrial laser displacement sensors generally use two methods of laser triangulation and laser echo analysis, in addition to the use of color confocal and interferometry principles for accurate displacement measurement

For laser displacement sensors, the laser triangulation method is suitable for high-precision, short-range measurement, and the laser echo analysis method is used for long-distance measurement

Laser trigonometry is a single-point or multi-dimensional distance measurement calculated from angles

The method of echo analysis is to transmit one million laser pulses per second by the laser transmitter to the object and return to the receiver, and the processor calculates the time it takes for the laser pulse to encounter the object and return to the receiver, so as to calculate the distance value, which is the average output of thousands of measurements, the so-called pulse time method, the farthest detection distance can reach 250m

In terms of accurate vibration measurement, the commonly used laser Doppler vibratometer (LDV) works on the basis of optical interference, through the superposition of two coherent beams I1 and I2

Although the laser trigonometry measures displacements relatively simple and reliable, the disadvantage is that the measurement accuracy decreases with the increase of the measurement distance and range, so the measurement range is limited

Two.

Haoliang Optoelectronics Newly launched laser displacement sensor is a small laser sensing platform, which combines these two mainstream sensing functions on an optical platform to achieve a variety of functions such as displacement measurement and vibration measurement, while maintaining high precision measurement while greatly reducing module size and cost

Current optical components are usually bulky and expensive, and the connection process with other electronic components requires a customized and accurate assembly process