Inventory of related listed companies in the integrated circuit packaging industry

[ Star Enterprise of Chemical Machinery Equipment Network ] Integrated circuits are known as the "food" of modern industry, the core of the information technology industry, and a strategic, basic and leading industry that supports economic and social development and safeguards national security.
National strategic leading industry
.

 

It has the advantages of small size, light weight, less lead wires and welding points, long life, high reliability, good performance, etc.
, and at the same time low cost, which is convenient for large-scale production
.
It is not only widely used in industrial and civil electronic equipment such as televisions and computers, but also in military communications
.

 

Packaging is the last process of integrated circuit manufacturing.
Integrated circuit packaging is the process of further processing the wafer that has passed the test to obtain an independent chip.
The purpose is to add functions that can be connected to external circuits for the contacts of the chip.
pins so that it can be connected to external circuits such as PCB boards
.
At the same time, packaging can add a "protective shell" to the chip to prevent the chip from being physically or chemically damaged
.
Therefore, packaging and testing is an indispensable part of the integrated circuit industry
.

 

Relevant agencies predict that my country's IC packaging and testing industry will reach 298.
5 billion yuan in 2022.
So, what are the relevant listed companies in the IC packaging and testing industry?
 

　　At present, there are few companies in China whose main business is related to integrated circuit packaging.
The listed companies mainly include: Changdian Technology, Tongfu Microelectronics, Huatian Technology, Jingfang Technology, Taiji Industry,
etc.

 

　　Changdian Technology: Jiangsu Changdian Technology Co.
, Ltd.
is a well-known semiconductor packaging and testing production base in China, providing customers with a complete set of solutions such as chip testing, packaging design, and packaging testing.
The company was successfully listed on the A board of the Shanghai Stock Exchange in June 2003
.

 

　　On the basis of the large-scale production of traditional IC packaging, Changdian Technology is committed to the research and development of high-end packaging technology, and has taken the lead in realizing the large-scale production of WL-CSP, SiP, copper pillar bump, Flip-Chip and other technologies in China Among them, 25um ultra-thin chip manufacturing technology, 25um ultra-thin chip stacking technology, high-density gold wire/copper wire bonding technology, micro-integrated system substrate technology (MIS), and high-density copper pillar bump technology have reached international standards.
The company will continue to seek greater breakthroughs in the fields of high-density, system integration, and micro-volume packaging technology in the future
.

 

　　Tongfu Microelectronics: Listed on the Shenzhen Stock Exchange on August 16, 2007, the company specializes in integrated circuit packaging and testing, and is controlled by the Chinese party and is responsible for operation and management
.

 

　　As a national high-tech enterprise, the vice-chairman unit of China Semiconductor Industry Association, and the executive vice-chairman unit of China IC Packaging and Testing Industry Chain Technology Innovation Alliance of the Ministry of Science and Technology, Nantong Fujitsu has always stood at the forefront of technological development in the industry and insisted on promoting development with science and technology
.
The company has post-doctoral workstations, provincial technology centers and engineering technology research centers, and has taken the lead in passing three international management system certifications of ISO9001, ISO14001 and ISO/TS16949 in the industry
.
Over the years, the company has undertaken and completed a number of national and provincial technological transformation projects, effectively promoting the industrialization of China's advanced packaging and testing technology
.

 

　　Huatian Technology: Founded on December 25, 2003, it was successfully listed on the Shenzhen Stock Exchange on November 20, 2007
.
Mainly engaged in the packaging and testing business of semiconductor integrated circuits and semiconductor components
.
As a global semiconductor packaging and testing company, Huatian Technology provides customers with one-stop services such as packaging design, packaging simulation, lead frame packaging, substrate packaging, wafer-level packaging, wafer testing and functional testing, logistics and distribution
.
With advanced technical capabilities, system-level production and quality control, it has become a brand in the semiconductor packaging and testing business
.

 

　　Jingfang Technology: Listed on the Shanghai Stock Exchange in 2014, it is a service provider dedicated to developing and innovating new technologies to provide customers with reliable, miniaturized, high-performance and cost-effective semiconductor packaging mass production services
.
Jingfang Technology's CMOS image sensor wafer level packaging technology has changed the world of packaging, making high-performance, miniaturized mobile phone camera modules possible
.

 

　　Taiji Industry: The company was established in 1966.
In 1993, it was renamed Wuxi Taiji Industry Co.
, Ltd.
and successfully listed on the Shanghai Stock Exchange, becoming the first listed company in Jiangsu Province
.
After more than 50 years of entrepreneurial development, transformation and upgrading, Taiji Industry has become a leading semiconductor (integrated circuit) manufacturer and service provider in China
.

 

　　At present, the main business includes semiconductor business, engineering technology service business and photovoltaic power station investment and operation business
.
The semiconductor business mainly involves IC chip packaging, packaging and testing, module assembly and testing, etc.
; the engineering technology business mainly serves electronic high-tech and high-end manufacturing, biomedicine and health care, municipal and road bridges, logistics and civil construction, electric power, comprehensive business, etc.
6 major business areas; the investment and operation of photovoltaic power plants began to gradually form in 2014
.

 

　　Original title: Inventory | Listed companies related to the integrated circuit packaging industry