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In the past ten years, low molecular weight dihydroxy polyphenylene ether and its end capping materials (key materials for 5G high-speed plates) have been occupying a global share for several foreign companies, and the research and development of domestic enterprises has been carried out
.
Recently, Shanghai Zaizheng Chemical Technology Development Co.
, Ltd.
uses independent intellectual property rights of the new process, and cooperates with Beijing CNPC Chuangyu Technology Co.
, Ltd.
for technical research, after more than three years of pilot tests, the production process has achieved a comprehensive technological breakthrough, the use of the material made of copper clad laminate has successfully passed the technical test, the indicators are more than the highest market share of a foreign brand, the current commercial production plant has been under construction, so far, the international 5G high-speed board material supplier will have a Chinese company
。