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Liquid crystal polymer development grade provides excellent anti-foaming properties for electronic connectors

 Last Update: 2022-08-21
 Source: Internet
 Author: User

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Polyplastics Group has announced new development grades of LAPEROS(R) Liquid Crystal Polymers (LCP) that provide excellent anti-foaming properties for electronic connectors

These two grades, currently in commercial readiness, have been shown to have higher anti-foaming properties than existing materials and show strong potential for improved productivity

LCP has strong heat resistance and fluidity, so it can be widely used in SMT (Surface Mount Technology) accessories

Polyplastics understands the importance of using materials with higher thermal stability and virtually no gas generation

In addition to high flow and dimensional accuracy, LCPs have high heat resistance and are being widely used in connector applications for devices such as smartphones, which are becoming more compact and trending towards SMT fittings

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