Mitsubishi Chemical is actively expanding its epoxy resin business: creating new demand with low-chlorine type and thin-film products

Mitsubishi Chemical is actively committed to the high value-added and application development of the epoxy resin business.

In terms of application development, it plans to develop new demand coatings online coatingol.

Mitsubishi Chemical is actively exploring the application of epoxy resin in high-value-added semiconductor applications, especially for packaging materials, and is committed to developing it into the industry standard epoxy resin

In addition, in recent years, semiconductor bonding wires have gradually changed from gold wires to lower-cost copper and silver wires, and low-chlorine packaging materials also have the effect of inhibiting corrosion on copper and silver wires

On the other hand, Mitsubishi Chemical hopes to break the existing concepts that the use of epoxy resin is limited to coatings, adhesives, and semiconductors, so it actively promotes various applications.

In addition, in the use of dissimilar bonding materials such as aluminum, iron, and carbon fiber composite materials, Mitsubishi Chemical plans to propose epoxy adhesive sheets

Mitsubishi Chemical believes that the thermosetting and high adhesion properties of epoxy resins will be expected to further expand market opportunities through compounding with other resins.