Normal epoxy resin room temperature curing agent

Since theentered into the 1990s, a lot of progress has been made in the study of epoxy adhesive heat resistance and room temperature curingFor example, russian scientific research institutions with special silicone resins and diMalayamide modified epoxy resins, so that the maximum operating temperature of adhesives to more than 400 degrees C research has achieved resultsIn recent years, a variety of uses of room temperature curing structural adhesives have also been reported, only a business publication in the United States in 1993 to the world launched a two-component room temperature curing adhesive slying there are nearly 2000 kindsBut there is not much research on epoxy adhesives that can combine both heat resistance and room temperature curingExperts recently highlighted the ordinary type - bisphenol A epoxy resin as the substrate room temperature curing adhesiveBisphenol A epoxy resin is the largest and most commonly used in the epoxy resin family of a large variety, its heat resistance and room temperature curing technology is also the most mature research, many products in this field have been put on the market and achieved good economic benefitsAccording to experts, in this regard, such as domestic DG-2, DG-3 type room temperature curing heat-resistant glue, to bisphenol A-type epoxy resin and liquid end-of-the-stage butyl butyl rubber pre-reaction, the use of modified amines and mitochondria curing agents, add the appropriate amount of silicone oxygen Alkane additives, room temperature curing 7 days after the maximum strength, the use temperature of up to 150 degrees C, T-type peeling strength of 30 to 60N/cm, can be bonded to aluminum and aluminum alloy, copper, brass, stainless steel, carbon steel, nylon and other materialsanother domestic CY-22 adhesive is an epoxy 618 (E-51) resin, modified amine curing agent and heat-resistant filler as the main component of the formulation of adhesive, after room temperature 24h curing can be put into use, 25 degrees C shear strength of 14.0MPa, at 120 to 150 degrees C can also maintain a certain strengthIn addition, the adhesive also has better compression, wear resistance performance, in addition to can be used as a heat-resistant structural adhesive, but also can be used as a wear-resistant repair agent and coatingDomestic researchers have also developed J-200-1D room temperature curing adhesive, the use of soyocyanate polyurethane pre-polymer to modify E-5l epoxy resin, and homemade a compound curing agent containing modified aromatic amine structure, high bonding strength of the product, but also has excellent moisture-resistant heat aging performanceAlthough some progress has been made in the study ofroom temperature curing heat-resistant epoxy adhesive, there are some problems, such as poor high temperature resistance compared with heating-cured heat-cured epoxy adhesive, mainly in the high temperature shear strength and peeling strength is low, the maximum use temperature is lowerExperts said that the focus of future research should mainly improve the temperature resistance of epoxy resin, specific methods include the use of high temperature-resistant resin modified epoxy resin, synthesis of new heat-resistant epoxy resin, etc; Better temperature curing system with better heat resistance and preparation of curing promoters suitable for this system to improve the curing speed of epoxy adhesive, in addition to in-depth exploration of the micromorphic form of epoxy resin, structure and high temperature performance, and further explore the relationship between sticky behavior and hardening mechanism