Reversible, Room Temperature Bonding of Glass Devices for Microfluidics
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Last Update: 2020-11-27
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Source: Internet
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Author: User
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This chapter describes a procedure for bonding glass microdevice substrates to their top plates by contact alone. This methodresults in devices that are robustly bonded but that can be separated, cleaned, and reused. For glass chips that have beenused for applications involving the transport of hard particles, cells, or other biological material, reversible bonding providesa way of increasing the chip’s lifetime and utility. Glass microdevices that are cleaned following this procedure can be successfullyused many times for electrophoresis or pressure-driven applications.
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