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    Home > Chemicals Industry > New Chemical Materials > Scientists develop circuit insulating materials based on new polymers to help solve chip heat dissipation

    Scientists develop circuit insulating materials based on new polymers to help solve chip heat dissipation

    • Last Update: 2021-09-21
    • Source: Internet
    • Author: User
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    Gordon Moore, one of Intel’s founders, once said that the number of transistors that can be accommodated on an integrated circuit will double approximately every 18 months
    .
    In other words, the performance of the processor doubles every two years
    .
    This sentence, as an empirical talk, reveals the speed of information technology progress to a certain extent, and became the famous "Moore's Law" later
    .
    However, with the continuous evolution of the manufacturing process, how to install more circuits and power supplies on smaller chips while maintaining good heat dissipation conditions has become an important challenge, and Moore's Law has slowed down in recent years
    .
    As a microprocessor, the chip size is relatively small, so low-permittivity materials are often necessary, because low-permittivity materials can limit electronic crosstalk, charge accumulation and signal propagation delay
    .
    However, all known low media exhibit low thermal conductivity, which complicates the heat dissipation of high-power chips
    .
    In addition, although the two-dimensional covalent organic framework combines larger permanent pores, which can lead to a low dielectric constant, its periodic layered structure can also give a relatively high thermal conductivity
    .
    However, the 2D materials produced by the traditional synthesis route are not suitable for application in the development of chips
    .
    In response to this problem, scientists have developed a new type of polymer-based circuit insulation material, which has low conductivity and high heat transfer performance, and can achieve higher power in a small space
    .
    The material is only as thick as one atom, and its performance can be controlled by layering it in a specific architecture
    .
    In addition, it can eliminate signal crosstalk by controlling the current, so that electronic products can further break through the current performance limits
    .
    Ideally, it can also remove the harmful heat caused by the current from the circuit
    .
    At present, scientists are applying this new material category by improving the method of producing high-quality 2D polymer films, trying to meet the requirements of miniaturizing transistors on dense chips
    .
    In the future, the material is expected to play a huge potential in the chip manufacturing industry, even beyond Moore's Law
    .
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