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【Chemical Machinery and Equipment Network Market Analysis】Kuaneng Semiconductor recently completed an angel round of
financing of more than 200 million yuan.
This round of financing was led by Heli Capital, with the participation of Wece Capital, Yunqi Capital, Guozhong Capital, Yida Capital, Gimpo Investment, Yachang Investment, Junsheng Investment and Fuhua Investment
.
financing of more than 200 million yuan.
This round of financing was led by Heli Capital, with the participation of Wece Capital, Yunqi Capital, Guozhong Capital, Yida Capital, Gimpo Investment, Yachang Investment, Junsheng Investment and Fuhua Investment
.
Semiconductors are used
in integrated circuits, optoelectronic devices, power electronic devices, microwave RF devices, communication systems, etc.
, namely new energy vehicles, rail transit, intelligent lighting, photovoltaic power generation, smart grid, optical fiber communication, satellite communication and consumer electronics.
The non-profit organization World Semiconductor Trade Statistics (WSTS) predicts that the world semiconductor market will grow by 16.
3% in 2022 and will continue to grow by 5.
1%
in 2023.
in integrated circuits, optoelectronic devices, power electronic devices, microwave RF devices, communication systems, etc.
, namely new energy vehicles, rail transit, intelligent lighting, photovoltaic power generation, smart grid, optical fiber communication, satellite communication and consumer electronics.
The non-profit organization World Semiconductor Trade Statistics (WSTS) predicts that the world semiconductor market will grow by 16.
3% in 2022 and will continue to grow by 5.
1%
in 2023.
Semiconductor demand is strong in 2022, with most major categories seeing high year-over-year growth
.
WSTS forecasts that growth is expected in all regions in 2022
.
Among them, the Asia-Pacific region is expected to grow by 13.
9%, with growth rates of 22.
6%, 20.
8% and 12.
6%
in the Americas, Europe and Japan, respectively.
.
WSTS forecasts that growth is expected in all regions in 2022
.
Among them, the Asia-Pacific region is expected to grow by 13.
9%, with growth rates of 22.
6%, 20.
8% and 12.
6%
in the Americas, Europe and Japan, respectively.
It is not difficult to see from the recent active financing of many semiconductor manufacturers that the popularity of the semiconductor market is not decreasing!
Yisichip Technology completed a new round of financing of hundreds of millions of yuan
Not long ago, Yisichip Technology completed a new round of financing of hundreds of millions of yuan, which will accelerate the commercial application of
DPU chips.
This round of financing was jointly led by JLSemi Jingluo Semiconductor and Renchen Semiconductor and their co-investors Daohuan Global Capital, and followed by Xiongniu Capital and existing shareholders Lishi Venture Capital and Oak Bud Capital
.
DPU chips.
This round of financing was jointly led by JLSemi Jingluo Semiconductor and Renchen Semiconductor and their co-investors Daohuan Global Capital, and followed by Xiongniu Capital and existing shareholders Lishi Venture Capital and Oak Bud Capital
.
According to insiders, this financing will accelerate the commercial application of Yisichip Technology in the field of DPU chips and smart network cards, and then promote the marketization and large-scale development of
the domestic DPU industry.
the domestic DPU industry.
Kuaneng Semiconductor received 200 million angel round financing
Nanjing Kuaneng Semiconductor Co.
, Ltd.
(hereinafter referred to as "Kuaneng Semiconductor"), a third-generation semiconductor company, recently completed an angel round of financing
of more than 200 million yuan.
This round of financing was led by Heli Capital, with the participation of Wece Capital, Yunqi Capital, Guozhong Capital, Yida Capital, Gimpo Investment, Yachang Investment, Junsheng Investment and Fuhua Investment
.
, Ltd.
(hereinafter referred to as "Kuaneng Semiconductor"), a third-generation semiconductor company, recently completed an angel round of financing
of more than 200 million yuan.
This round of financing was led by Heli Capital, with the participation of Wece Capital, Yunqi Capital, Guozhong Capital, Yida Capital, Gimpo Investment, Yachang Investment, Junsheng Investment and Fuhua Investment
.
Founded in November 2021, Kuaneng Semiconductor is committed to deeply cultivating the field of power semiconductor device foundry, providing high yield, high quality and competitive products
for domestic and foreign semiconductor design companies and IDM manufacturers.
Its first production line landed in Nanjing, is under construction, and will be the largest silicon carbide semiconductor fab in China
.
for domestic and foreign semiconductor design companies and IDM manufacturers.
Its first production line landed in Nanjing, is under construction, and will be the largest silicon carbide semiconductor fab in China
.
Basic Semiconductor completed the C2 round of financing
Shenzhen Basic Semiconductor Co.
, Ltd.
recently completed the C2 round of financing, which was jointly invested
by GAC Capital, Runxia Zhaoying, Blue Ocean Huateng (300484) and other institutions.
In September 2021, Basic Semiconductor completed the C1 round of financing, which was jointly invested
by Songhe Capital and other institutions.
, Ltd.
recently completed the C2 round of financing, which was jointly invested
by GAC Capital, Runxia Zhaoying, Blue Ocean Huateng (300484) and other institutions.
In September 2021, Basic Semiconductor completed the C1 round of financing, which was jointly invested
by Songhe Capital and other institutions.
It is understood that this financing will be used to further promote the research and development progress of silicon carbide power devices and the construction of manufacturing bases, continuously strengthen market expansion in the field of new energy vehicles and photovoltaic power generation, and ensure the leading position
of basic semiconductors in the field of domestic silicon carbide devices.
of basic semiconductors in the field of domestic silicon carbide devices.
Lesheng Semiconductor received tens of millions of yuan in pre-A round financing
Recently, TFT LCD screen control chip R & D enterprise "Lesheng Semiconductor" announced the completion of tens of millions of yuan of pre-A round of financing, this round of financing is jointly invested
by AVIC Fund and Zijingang Capital.
The funds will be used to increase R&D and sales teams, expand production capacity, and accelerate new product development
.
by AVIC Fund and Zijingang Capital.
The funds will be used to increase R&D and sales teams, expand production capacity, and accelerate new product development
.
With the upgrading of consumption and the development of the Internet of Things, all kinds of home appliances and terminal equipment will continue to increase and accelerate iteration, and the application of display control chips widely used in image display systems is becoming more and more extensive, and the display chip market upstream of the industrial chain will usher in continuous benefits
.
.
In the future, Lesheng Semiconductor will deeply cultivate the home appliance market, expand the market of various Internet of Things devices, and provide customers with professional TFT color screen display control chips, contributing to the development of China's display industry and making the world more colorful
.
.
Gaoyun Semiconductor completed a B+ round of financing of 880 million yuan
FPGA chip developer Gaoyun Semiconductor recently announced the completion of a B+ round of financing
with a total scale of 880 million yuan.
The financing was led by Guangzhou Bay Area Semiconductor Industry Group Co.
, Ltd.
, after the completion of the investment, Guangzhou Bay Area Semiconductor Industry Group Co.
, Ltd.
also became the largest shareholder, Guangdong Guangdong Macao Semiconductor Industry Investment Fund (Limited Partnership) and Shanghai Semiconductor Equipment Materials Industry Investment Fund Partnership (Limited Partnership) co-invested, and the old shareholders also continued to invest
more.
with a total scale of 880 million yuan.
The financing was led by Guangzhou Bay Area Semiconductor Industry Group Co.
, Ltd.
, after the completion of the investment, Guangzhou Bay Area Semiconductor Industry Group Co.
, Ltd.
also became the largest shareholder, Guangdong Guangdong Macao Semiconductor Industry Investment Fund (Limited Partnership) and Shanghai Semiconductor Equipment Materials Industry Investment Fund Partnership (Limited Partnership) co-invested, and the old shareholders also continued to invest
more.
This round of funds will continue to increase investment in technology research and development, market sales, operation management, etc.
, and solid financial barriers will provide significant assistance
for the company to continue to promote the localization strategy of FPGA chips.
In the future, Gaoyun Semiconductor will focus on investment in the automotive field, accelerate the layout, and strive to provide more reliable and efficient FPGA products for the automotive industry and expand industrial influence
.
, and solid financial barriers will provide significant assistance
for the company to continue to promote the localization strategy of FPGA chips.
In the future, Gaoyun Semiconductor will focus on investment in the automotive field, accelerate the layout, and strive to provide more reliable and efficient FPGA products for the automotive industry and expand industrial influence
.
Die Gravel Semiconductor completed tens of millions of angel round financing
High-end digital-analog hybrid chip design company "Moble Semiconductor" completed tens of millions of yuan in angel round financing, led by Lanpu Capital
.
The financing funds will be used to increase R&D investment in enterprises, strengthen supply chain cooperation, and accelerate the landing progress
of chip products.
It is reported that Moble Semiconductor currently has a total of 3 published patent applications, all of which are invention patents, mainly related
to field-effect transistors, voltage converters and other fields.
.
The financing funds will be used to increase R&D investment in enterprises, strengthen supply chain cooperation, and accelerate the landing progress
of chip products.
It is reported that Moble Semiconductor currently has a total of 3 published patent applications, all of which are invention patents, mainly related
to field-effect transistors, voltage converters and other fields.
Moxin Semiconductor completed tens of millions of angel round financing
High-end vehicle control chips are a high-barrier and high-prosperity subdivision track
that industry investors are optimistic about.
Wuxi Moxin Semiconductor Co.
, Ltd.
(hereinafter referred to as Moxin Semiconductor) recently announced the completion of tens of millions of angel round financing
.
This round of financing is led by Prosperous Investment, and the funds will be used for the development and tape-out of functional safety ASIL-D level domain controller and gateway chips
.
that industry investors are optimistic about.
Wuxi Moxin Semiconductor Co.
, Ltd.
(hereinafter referred to as Moxin Semiconductor) recently announced the completion of tens of millions of angel round financing
.
This round of financing is led by Prosperous Investment, and the funds will be used for the development and tape-out of functional safety ASIL-D level domain controller and gateway chips
.
Moxin Semiconductor and the domestic top Tier1 jointly define the chip from the demand side, completed the definition and logic design of the domestic high-performance domain control chip benchmarked against the high-end MCU of the international automotive chip manufacturer, and will complete the tape-out in the next few months, and is expected to start sending samples to customers in
early 2023.
After that, the company will go all out to seize this strategic opportunity period and contribute to the domestic replacement of automotive chips with the highest functional safety, high reliability and high performance
.
early 2023.
After that, the company will go all out to seize this strategic opportunity period and contribute to the domestic replacement of automotive chips with the highest functional safety, high reliability and high performance
.
Qilingxin completed financing of about 600 million yuan
Qilingxin, which was just established in the second half of last year, has completed angel rounds and A rounds of financing
totaling about 600 million yuan.
It is understood that the company's angel round investors include the founders of many semiconductor companies such as Si Lijie, Shixin Technology, Weier Co.
, Ltd.
, Hengxuan Technology, etc.
, and the A round investors include Lightspeed China
.
totaling about 600 million yuan.
It is understood that the company's angel round investors include the founders of many semiconductor companies such as Si Lijie, Shixin Technology, Weier Co.
, Ltd.
, Hengxuan Technology, etc.
, and the A round investors include Lightspeed China
.
Through this round of investment, the company can further increase its own investment in R&D CPUs, thereby accelerating the progress of
CPU R&D.
At present, China's CPU companies are in the very early stage of developing products, and if Qi Lingxin can complete CPU production as soon as possible with the help of this round of investment, the CPU market will enter a new round of reshuffling stage
.
CPU R&D.
At present, China's CPU companies are in the very early stage of developing products, and if Qi Lingxin can complete CPU production as soon as possible with the help of this round of investment, the CPU market will enter a new round of reshuffling stage
.
Hongjun Microelectronics completed nearly 800 million yuan angel round and pre-A round of financing
Hangzhou Hongjun Microelectronics Technology Co.
, Ltd.
(hereinafter referred to as "Hongjun Microelectronics") announced that it has completed nearly 800 million yuan of angel round and pre-A round financing jointly led by Walden International, Hillhouse Venture Capital and CDH VGC (Innovation and Growth Fund), with many leading industry partners such as Wallwood Technology, Xinlan Micro, Chendao Capital, and Xingrui Capital co-investing, and other investors including Songhe Capital, Six Pulse Capital, C Capital, Zhongyi Ren Capital, Haihe Qirui Capital, Small is Big Venture Capital, etc
.
, Ltd.
(hereinafter referred to as "Hongjun Microelectronics") announced that it has completed nearly 800 million yuan of angel round and pre-A round financing jointly led by Walden International, Hillhouse Venture Capital and CDH VGC (Innovation and Growth Fund), with many leading industry partners such as Wallwood Technology, Xinlan Micro, Chendao Capital, and Xingrui Capital co-investing, and other investors including Songhe Capital, Six Pulse Capital, C Capital, Zhongyi Ren Capital, Haihe Qirui Capital, Small is Big Venture Capital, etc
.
High-performance server CPUs have always been the crown jewel
of chip design.
In addition to the need to adopt state-of-the-art semiconductor production processes, the PPA constraints it faces and various "balanced designs"
in chip microarchitecture design.
The financing will be mainly used for the expansion of the team required for the R&D of high-performance server CPUs and the construction of related R&D infrastructure
.
of chip design.
In addition to the need to adopt state-of-the-art semiconductor production processes, the PPA constraints it faces and various "balanced designs"
in chip microarchitecture design.
The financing will be mainly used for the expansion of the team required for the R&D of high-performance server CPUs and the construction of related R&D infrastructure
.
Original: Semiconductor demand market heat does not decrease 9 companies completed financing
