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Recently, researchers from the Shanghai Institute of Optics and Precision Mechanics (Shanghai Institute of Optics and Mechanics) of the Chinese Academy of Sciences used a combination of chemical etching and laser polishing to process fused silica to obtain ultra-smooth (high damage threshold) high-performance optical media
.
This research will enhance the application value of fused silica materials in the field of optics.
The research results are published in Optics Letters, DOI:10.
1364/OL.
409857
.
? a: Schematic diagram of laser polishing system b: the evolution process of surface morphology in material composite processing? Laser damage of fused silica, especially UV laser damage, is still a key issue that restricts the development of high-power laser systems
.
Traditional fused silica processing methods have undergone two processes: grinding and chemical mechanical polishing (CMP)
.
This method is time-consuming and prone to surface and sub-surface defects, resulting in a significant reduction in the damage threshold of the fused silica surface
.
? The new method adopted by the researchers of the Shanghai Institute of Optics and Mechanics, first uses chemical etching to open up the sub-surface defects of ground fused silica, and then uses CO2 laser polishing to reduce the surface roughness
.
? Through the analysis of damage and defects, it is found that the new method avoids the introduction of surface and subsurface defects including chemical structure and active metal impurities
.
This means that the fused silica material has obtained a better laser damage threshold (the maximum laser power that the medium can withstand per unit area is called the laser damage threshold of the medium)
.
.
This research will enhance the application value of fused silica materials in the field of optics.
The research results are published in Optics Letters, DOI:10.
1364/OL.
409857
.
? a: Schematic diagram of laser polishing system b: the evolution process of surface morphology in material composite processing? Laser damage of fused silica, especially UV laser damage, is still a key issue that restricts the development of high-power laser systems
.
Traditional fused silica processing methods have undergone two processes: grinding and chemical mechanical polishing (CMP)
.
This method is time-consuming and prone to surface and sub-surface defects, resulting in a significant reduction in the damage threshold of the fused silica surface
.
? The new method adopted by the researchers of the Shanghai Institute of Optics and Mechanics, first uses chemical etching to open up the sub-surface defects of ground fused silica, and then uses CO2 laser polishing to reduce the surface roughness
.
? Through the analysis of damage and defects, it is found that the new method avoids the introduction of surface and subsurface defects including chemical structure and active metal impurities
.
This means that the fused silica material has obtained a better laser damage threshold (the maximum laser power that the medium can withstand per unit area is called the laser damage threshold of the medium)
.
