echemi logo
Product
  • Product
  • Supplier
  • Inquiry
    Home > Chemicals Industry > Chemical Technology > Shenzhen Advanced Institute developed embedded surface metalized electromagnetic shielding composite foam material

    Shenzhen Advanced Institute developed embedded surface metalized electromagnetic shielding composite foam material

    • Last Update: 2021-06-21
    • Source: Internet
    • Author: User
    Search more information of high quality chemicals, good prices and reliable suppliers, visit www.echemi.com

    With the rapid development of electronic devices and communication equipment in the direction of lighter and thinner and higher frequency, the problem of electromagnetic interference (EMI) has become more and more serious.
    There is an urgent need for high-performance electromagnetic shielding materials to solve this problem
    .
    Electromagnetic shielding materials mainly achieve high-efficiency shielding of electromagnetic waves by improving electrical conductivity


    .


    Researcher Sun Rong’s team from Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences and Shenzhen Institute of Advanced Electronic Materials International Innovation, published in the Chemical Engineering Journal using In-situ metallized carbon nanotubes/poly(styrene-butadiene-styrene) (CNTs/SBS) foam for electromagnetic The latest research results were published on the topic of interference shielding, and an embedded surface metallized high-efficiency electromagnetic shielding composite foam material with strong interface bonding was developed
    .
    The researchers used styrene-butadiene-styrene block copolymers (poly(styrene-block-butadiene-block-styrene), SBS) as the polymer matrix, and carbon nanotubes (CNTs) as conductive fillers.


    The CNTs/SBS composite foam is first prepared by freeze-drying technology, and then the ion dipolar effect of trifluoroacetic acid ion and ethanol hydroxyl is used to realize the adsorption and in-situ reduction of the silver salt precursor on the superficial layer of the SBS matrix, and then the surface metal is prepared Of Ag/CNTs/SBS composite foam


    Assistant engineer Tian Dingkun is the first author of the paper, and associate researcher Hu Yougen and researcher Sun Rong are the co-corresponding authors of the paper
    .
    The research work was funded by the National Natural Science Foundation of China and the Shenzhen Basic Research Project


    .


    (a) Physical image of Ag/CNTs/SBS composite foam; (b) SEM image of Ag embedded in the superficial layer of polymer matrix in Ag/CNTs/SBS composite foam; (c) Traditional surface metallization and surface metallization in this study Schematic diagram of the comparison of the effects of the composite foam; (d) Cyclic mechanical and electrical properties of Ag/CNTs/SBS composite foam at a strain of 50%; (e) Schematic diagram of the microstructure before and after compression of the Ag/CNTs/SBS composite foam and its electromagnetic shielding mechanism

    This article is an English version of an article which is originally in the Chinese language on echemi.com and is provided for information purposes only. This website makes no representation or warranty of any kind, either expressed or implied, as to the accuracy, completeness ownership or reliability of the article or any translations thereof. If you have any concerns or complaints relating to the article, please send an email, providing a detailed description of the concern or complaint, to service@echemi.com. A staff member will contact you within 5 working days. Once verified, infringing content will be removed immediately.

    Contact Us

    The source of this page with content of products and services is from Internet, which doesn't represent ECHEMI's opinion. If you have any queries, please write to service@echemi.com. It will be replied within 5 days.

    Moreover, if you find any instances of plagiarism from the page, please send email to service@echemi.com with relevant evidence.