echemi logo
Product
  • Product
  • Supplier
  • Inquiry
    Home > Coatings News > Paints and Coatings Market > The development of transparent epoxy perfusion adhesive at room temperature

    The development of transparent epoxy perfusion adhesive at room temperature

    • Last Update: 2020-12-27
    • Source: Internet
    • Author: User
    Search more information of high quality chemicals, good prices and reliable suppliers, visit www.echemi.com
    China Paint Online News News
    Wang Xiuyan 1, Jiang Hui 1, Fan Xiuming 1, Fengli 1, Shi Lixiu 2 (1. Jilin Agricultural Science and Technology Institute, Jilin Jilin 132101; 2. Shanghai Zhengtai Chemical Co., Ltd., Shanghai 201802)
    Summary: Type A EP with BPA (1. Epoxy resin) as a substation resin, D-230 (polyetheramine) as a curing agent, and the introduction of good synergy with D-230 N-AEP (N-pyrylphenol), the preparation of two-part EP potion glue; The results show that the EP potion can cure at room temperature, and its transparency and gloss are good, when m (EP): m (benzoyl alcohol) m (N-AEP) m (D-230): m (deboster) 30: At the appropriate amount, the comprehensive performance of the potting glue is good, and the electronic components of the package are clearly visible, can be measured one by one by needle parameters, easy to detect and repair;
    key words: epoxy resin; perfusion glue; thinner; curing agent; synergy effect
    In the figure classification number: TQ433.437 document mark code: A article number: 1004-2849 (2013) 08-0036-04
    The irrigation process0.0
    Potting process refers to an operating process in which the components that constitute electronic components are reasonably arranged, assembled, connected, sealed and protected according to the requirements, in order to prevent the intrusion of water, dust and harmful gases into the electronic components, so that the electronic components can achieve the purpose of slowing down vibration, preventing external force damage and stabilizing parameters. There are many kinds of irrigation materials (usually refer to potted glue) for electronic components, mainly EP (epoxy resin) potted glue, silicone potted glue and PU (polyurethane) potted glue. Among them, EP potted adhesive has excellent mechanical properties, electrical insulation properties, heat resistance, chemical media resistance and simple molding process, and is widely used in high-tech fields such as machinery, electronics, communications and aerospace. Therefore, in recent years, domestic and foreign researchers have carried out a lot of research on the modified EP potion adhesive, most of the EP's modified research mainly focuses on toughening.
    this study used BPA-type EP (i.e. E-51) as a base resin, benzoyl alcohol as a thinner, a well-transparent polyetheramine (D-230) as a curing agent, and introduced N-AEP (N-phenol) with good synergy with D-230, to prepare bisome transparent room temperature curing TYPE EP potion. The EP potting glue can make the encapsulated electrolyte capacitor, small transformer and other electronic components clearly visible, and can be used to measure some parameters of electronic components one by one by needle, which is conducive to its detection and repair.
    1. Test part
    1.1 test raw materials
    epoxy resin (EP), industrial grade (grade E-51), Guangzhou City, The chemical industry professional chemical raw materials operating company; N-AEP, industry Grade, Nanjing Zhongheng Chemical Co., Ltd.; Polyetheramine (D-230), industrial grade, Suzhou Changke Industrial Co., Ltd.; benzoyl alcohol, pure analysis, Shanghai Meirrell Chemical Technology Co., Ltd.; desiccant, industrial grade (grade 691), commercially available.
    1.2 test instrument
    WDW-20 electronic all-energizer test machine, Shenzhen Junrui Instrument and Equipment Co., Ltd.; CN61M/KY-PCY-III material line expansion coefficient analyzer, Beijing Zhongxi Yuanda Technology Co., Ltd.;
    XHS-A type Shore hardness meter, Yingkou City emerging test machinery factory; three-roll grinder, Changzhou City Longxin Chemical Machinery Co., Ltd.; XJJUD-50 combination cantilever beam impact test machine, Jinan Yongke Test Instrument Co., Ltd.; QBC-3D high-frequency Q table with S914 media loss test device, Shanghai Ai make electronic instrument factory; WKW-400 series computer-controlled thermal deformation Vika temperature meter, Changchun City Intelligent Instrument Equipment Co., Ltd.
    1.3 Test preparation
    (1) A part preparation: EP, phenyl alcohol, N-AEP and deboist mixed evenly, high-speed stirring, vacuum packaging, that is, A part.
    (2) B parts of the preparation: D-230, benzoyl alcohol and so on mixed evenly, that is, B parts.
    (3) EP potted glue preparation and test casting body preparation: according to m (A parts): m (B parts) - 5:1 ratio, the two mixed evenly into the mold cavity, (23±2) after curing 7d, the performance of the determination.
    1.4 test or
    (1) line expansion coefficient: according to GB/T1036-2008 standard.
    (2) water absorption rate: according to GB/T1034-2008 standard for determination, then the absorption rate is (after soaking sample quality - drying to constant sample quality before immersion) / drying to constant sample quality before immersion.
    (3) bending strength: according to GB/T2570-1995 standard, the use of a 10-energy material test machine for determination (load rate of 5mm/min, room temperature determination).
    (4) impact strength: measured according to GB/T6328-1999 (sample size is 540mm×320mm×740mm, 5 to 35 degrees C).
    (5) dielectric constant: according to GB/T1694-1981 standard, the media loss test device is used for (room temperature) determination.
    (6) hardness: according to GB/T531.1-2008 standard, the use of shore hardness meter for determination (room temperature).
    (7) thermal deformation temperature: measured according to GB/T1634-2004 (AC voltage is 220V and frequency is 50Hz).
    2. Results and discussion
    2.1EP selection
    EP has little value for use alone;
    variety of EPs, and the E-51 has excellent bonding properties, chemical resistance and compatible (with solvents, desolation agents, etc.), which is conducive to construction operations. Therefore, the study selected E-51 as the substring resin of EP potion gel.
    2.2 thinner selection
    usually using active diluents and inactive diluents to dilute EP potions: active diluents have the disadvantages of higher price, volatility and toxicity, inactive diluents have higher VOC (organic volatiles) content, and migration occurs. Phenyl methanol itself is non-toxic (can be used for human injection reagents), high boiling point (not volatile), polarity (good compatible with EP, no migration phenomenon), can promote the curing reaction of EP/amine (accelerated reaction rate), hydrophobic (can significantly improve the gloss of the coating, reduce albody phenomenon) and can improve the toughness of EP curing, but it needs to avoid light preservation (otherwise it will appear yellowing and other phenomena).
    therefore, the study selected benzoyl alcohol as the thinner of EP potion gel, and under the premise that other conditions remained the same, the effect of benzoyl alcohol content on the performance of perfusion glue was examined, and the results were shown in Table 1.
    Table 1 Phenyl alcohol content on the performance of potted adhesive
    As can be known from Table 1: With the increasing content of benzoyl alcohol, the absorption rate of potted adhesive increased slightly, hardness, dielesis constant and thermal deformation temperature were all first up and then down. This is due to excessive thinner content, which causes the product to cure incompletely.
    , it is more appropriate to choose w (benzoyl alcohol) - 15%, at this time the comprehensive performance of the potted adhesive is relatively best.
    2.3 Curing agent selection
    Curing agent is one of the main components of EP potion adhesive, its type and performance not only directly affect the main properties of EP potion adhesive (e.g. aesthetic performance, optical performance and bonding performance, etc.), but also the curing rate of EP potion adhesive, surface brightness In addition, the EP itself is a low Mr (relative molecular mass) thermoplastic polymer, must be added alkaline or acidic curing agent in order to make epoxy group in the EP open ring, cross-link, and form insoluble mesh structure curing products.
    In accordance with the process requirements of the potted glue, the viscosity of the potted adhesive should be as low as possible (on the one hand, it can make the irrigation process run smoothly, on the other hand, it is conducive to the system to fully drain the foam), the curing temperature and curing speed should be moderate . when the curing temperature is too low, the curing rate is too slow. At this time, although it is conducive to the system flow level deblistering, but the production efficiency is reduced, when the curing temperature is too high, the system reaction rate is too fast, although the production efficiency is improved, but the plastic shell because the temperature is too high and easy to deform, and the curing too fast can easily cause a burst and is not conducive to de-foaming (surface level difference).
    , the curing agent is required to meet the requirements of long application period, high activity, low viscosity, good electrical performance and high transparency. A large number of comparative test results show that there is a good synergy between the transparent D-230 curing agent and N-AEP, and fully meet the requirements of the use of EP potion adhesive curing agent, and can be used as a room temperature curing agent of EP potion adhesive. Therefore, the study used D-230/N-AEP as the curing agent of EP potion adhesive, and under the premise that other conditions remained the same, the effect of the total content of the two on the performance of potion glue was examined, and the results were shown in Table 2. As can be known from Table 2: With the increasing total content of curing agent, the dielectural constant, impact strength, thermal deformation temperature and hardness of the pottation glue are all up and down.
    Table 2 D-230 N-AEP Total Content On The Performance of Perseal Gel
    This is due to the fact that when the total content of curing agents is low, the potion gel is not completely cured, i.e. the substation resin in the potted material is In a relatively short period of time did not form the best three-dimensional cross-network structure, so the mechanical performance of potted glue is relatively poor, at the same time, the material is easy to be under the action of lower electric field strength orientation, the electronic binding energy in the system is also significantly reduced, so the dielectic properties of the material is reduced. When the total content of curing agent in the system is too much, the excess curing agent (containing ether bond) plays the role of toughener in the system, so the mechanical strength of the pottation glue decreases and the toughness is improved;
    , it is more appropriate to select w (D-230/N-AEP) . . . 35%, at which point the combined performance of the potted adhesive is relatively best.
    2.4 the optimization formula of the potted adhesive is determined and verified
    In summary, the optimal formula for the preparation of transparent EP potion gel is m (EP): m (benzoyl alcohol): m (N-AEP) m (D-230) m (deblister) - 100:15:5:30: appropriate, in fact, the measurement performance as shown in Table 3. By Table 3: by the optimal formula made of potted glue, its performance meets the requirements of indicators, with good application prospects. Table
    3 Measured performance of the optimal formula potted adhesive
    3. Conclusion
    (1) E-51 as a base resin, D-230 as a curing agent, and the introduction of N-AEP with good synergy with D-230, preparation of two-part transparent EP potion glue;
    (2) Compared with the use of a single curing agent D-230 system, this study home-made two-component transparent EP potion adhesive in this study, under the premise of ensuring the performance of the force, electrical insulation performance and heat resistance to meet the requirements, has a higher light transmission, transparency and gloss than the previous, and is more conducive to the detection and repair of electronic components.
    (3) the two-part transparent EP potion adhesive has good comprehensive performance and can be widely used for electrolyte capacitors, small transformers and other at room temperature potation.
    the
    , Sun Manning. Principles and Technologies for the Application of Epoxy Resin: Beijing: Machinery Industry Press, 2002.
    Wang De zhong. Epoxy resin production and application of the version of M. 2. Beijing: Chemical Industry Press, 2001.
    [3] ROTH G,SMITH G A,GRINSTEIN R,et al. Solid acrylicresin using a
    continuous tube reactor:WO,9 804 593 [P].1998-02-05.
    。 Hahn Hua, Ko Kaichang, Chen Lixin. Advances in the study of epoxy potted materials, 2003, 22 (10): 1057-1060.
    This article is an English version of an article which is originally in the Chinese language on echemi.com and is provided for information purposes only. This website makes no representation or warranty of any kind, either expressed or implied, as to the accuracy, completeness ownership or reliability of the article or any translations thereof. If you have any concerns or complaints relating to the article, please send an email, providing a detailed description of the concern or complaint, to service@echemi.com. A staff member will contact you within 5 working days. Once verified, infringing content will be removed immediately.

    Contact Us

    The source of this page with content of products and services is from Internet, which doesn't represent ECHEMI's opinion. If you have any queries, please write to service@echemi.com. It will be replied within 5 days.

    Moreover, if you find any instances of plagiarism from the page, please send email to service@echemi.com with relevant evidence.