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    Home > Coatings News > Paints and Coatings Market > There are 7 methods for the analysis of the principle of epoxy adhesive and the enhancement of bonding strength.

    There are 7 methods for the analysis of the principle of epoxy adhesive and the enhancement of bonding strength.

    • Last Update: 2020-10-04
    • Source: Internet
    • Author: User
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    Performance: Epoxy adhesive system by epoxy resin reinforcement agent, fillers and other preparations. High bonding strength, high hardness, good rigidity, acid resistance, alkali, oil and organic solution, small curing shrinkage, can be used as metal, cement, ceramics, glass, stone, wood, thermostate plastics and other materials of structural adhesives and building potted materials.
    principle analysis: Formula, epoxy resin and PVC resin as the main adhesive components, phthalates as plasticizers, quartz powder and white carbon black as fill modifiers, tefluoride boricillin, teflonolamine as a curing agent, phosphoric acid as an acidification agent, and increase the adhesion of the metal
    two-part room temperature cured epoxy adhesive. Apply a certain amount of pressure after applying the product to the bonded surface. it can be cured at room temperature. The curing conditions are 14-16 seconds at 16.5 degrees Celsius, 7-9 seconds at 25 degrees Celsius, and 4-6 seconds at 30 degrees Celsius. Mainly used in a variety of metals and metals, metals and non-metallic, as well as a variety of hard plastic products bonding, with a high bonding strength.
    Epoxy adhesive bonding strength enhancement method: Although the adhesive bonding strength is relatively high, but for some high-strength structural bonding is still insufficient, but also need to further improve the bonding strength, can be enhanced by the following ways.
    1 using high-performance epoxy resin
    some high-performance epoxy resins, such as AG180, AFG 190, phenolic epoxy resin, like F epoxy resin, bisphenol S epoxy resin, liquid crystal epoxy resin, TDE185 (IJ)), 731, etc., alone or mixed with bisphenol A epoxy resin, have a high bonding strength. Liquid crystal epoxy resin is a highly molecularly ordered, deep molecular cross-linking polymer network, can form a self-reinforcing structure, the performance of quite excellent. A small amount of liquid crystal ring maple resin mixed with B144 epoxy resin, the curing material's stretch strength and impact strength is obviously thrown out of the island.
    2 Choice of enhanced curing agent
    curing agent has an important impact on the bonding strength of epoxy adhesive, the choice of epoxy adhesive after adhesion bonding strength of high curing agents, such as dicyanide, interphenylamine, diamina diphenyl methane, diamino diphenyl, low molecular polyamide Amines (315, 3051), G11328, end amino polyether, 105 peptides, methyl hexahydrobenzene, biphenyl diazine/benzene (20/28), 21 ethyl 14 methyl methylene, linear phenol resin, etc.
    epoxy resin pre-branched with CTBN, with polyetheramine (polyetheramine) as an internal toughening curing agent, using a double toughening system, so that room temperature curing epoxy adhesive room temperature shear strength of 35MPa. 90 to peel strength over 3.5kN/m.
    addition of an enhanced filler
    3 reduces the thermal expansion coefficient and curing shrinkage of the curing and reduces the internal stress. When cracks appear under overload, the filler layer also prevents the crack from expanding, increasing bonding strength. For example, epoxy adhesives for bonding metal structures, adding the right amount of iron powder can improve shear strength. Enhanced fillers are silicon micro-powder, white carbon black, silica ash powder, alumina, ultra-fine aluminum silicate, lightweight oxidation set, talcum powder, sea foam powder, bump rod soil powder, ultra-fine calcined kaolin, iron oxide powder, iron powder, aluminum powder, zinc powder, glass phosphorus tablets, stainless steel scales, dolomite powder and so on.
    4 Inorgeous crystal needs to enhance
    the wafer is a very small diameter fiber grown in the form of a single crystal under special conditions, with a highly ordered atomic arrangement structure, so that it can be close to the theoretical strength of the price bond between atoms, used to enhance the epoxy adhesive has great potential. Available crystals must be zinc oxide wafer, calcium sulfate wafer, calcium carbonate wafer, aluminum boric acid wafer, titanium-based wafer, hydroxyurea agriite wafer, magnesium hydroxide wafer, alkaline magnesium sulfate wafer, silicon carbide wafer, etc.
    5 fiber-reinforced
    glass fiber, carbon fiber, aromatic polyamide fiber (Kevlar fiber), Veron fiber, polyethylene alcohol fiber, polyphenyl ether fiber, stainless steel fiber, basalt fiber, stone fiber, etc. can be enhanced to epoxy adhesive.
    6 silane coupled agent enhancement
    add appropriate amount of silane coupled agent, such as KH one 560, KH one 550, KH1580, KH1590, KH1792, Nanda 112, Nanda 1 73, A11186, A11160, etc., can effectively improve the bonding strength of epoxy adhesive. For example, epoxy glue bonded aluminum, added KH 550 (1%) shear strength of 11.6.MPa;
    7 using membrane epoxy adhesive
    membrane epoxy adhesive referred to as epoxy film, manufacturing with a relatively high molecular quality of bisphenol type A solid epoxy resin and multi-official epoxy resin. The film is easy to ensure uniform thickness when bonding, so bonding strength is very high.
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