TSMC’s U.S. expansion: Where have Japanese material manufacturers built their plants?

TSMC’s Arizona campus was still largely desert and undeveloped land in April 2021; by March 2024, large-scale construction zones had emerged. By July 2025, building clusters were fully formed, accompanied by extensive photovoltaic arrays. As of May 2026, the main structures of the first three fabs had been substantially completed. KPPC’s new plant—three-stage construction comparison (2024–2026); right image shows August 2026 In February 2024, the KPPC site consisted mainly of farmland and vacant lots. By June 2025, site preparation had begun in some areas; the August 2026 imagery shows the site fully graded, with orderly road grids, multiple building outlines, and extensive on-site infrastructure visible. TOK Oregon (left) and Fujifilm Mesa (right): Existing facilities, Q2 2026 imagery Both TOK Oregon and Fujifilm Mesa are established facilities; their footprints showed no significant change between 2024 and 2026. 03 Corporate Construction Progress TSMC Fab 21: Phase I in mass production; Phases II and III underway TSMC’s Arizona Fab 21 Phase I entered high-volume manufacturing in Q4 2024 using N4 process technology. Structural construction for Phase II was completed in 2025, with mass production of N3 scheduled for H2 2027. Phase III broke ground in April 2025, targeting N2 and A16 process technologies; its main structure was completed in May 2026. Construction of a fourth wafer fab and TSMC’s first advanced packaging facility also commenced in 2026. KPPC: Groundbreaking in December 2025 KPPC Advanced Chemicals, a U.S. subsidiary of KANTO-PPC, broke ground on December 19, 2025, in Casa Grande, Arizona. UAP Phase I investment exceeds USD 120 million; total planned investment is approximately USD 500 million. The project aims to commence operations by end-2027, producing semiconductor-grade ultra-high-purity chemicals. It plans to supply major chipmakers including TSMC, Intel, and Micron, and is expected to create around 200 full-time jobs upon full completion. TOK Oregon: TOK’s first overseas photoresist production base in the U.S. TOK (Tokyo Ohka Kogyo) began operations at its Oregon factory in Hillsboro in May 1993—the company’s first overseas manufacturing base. In May 1997, it completed its first overseas semiconductor photoresist production facility at this site. Fujifilm Mesa: CMP slurries and high-purity solvents Fujifilm Electronic Materials USA is located in Mesa, Arizona (6550 S Mountain Rd), primarily manufacturing CMP slurries and high-purity solvents.

Semiconductor equipment industry highlights roundup

6. Gaoke Technology’s first-half performance surges significantly; semiconductor precision valve components accelerate domestic adoption On August 26, Gaoke Technology disclosed its operating results for the first half of the year: revenue reached RMB 327 million, up 35.46% year-on-year; net profit attributable to shareholders amounted to RMB 106 million, up 95.07% year-on-year—marking a substantial improvement in profitability. The company specializes in piezoelectric jet valves and piezoelectric proportional valves, breaking the monopoly previously held by overseas suppliers. Its products serve precision fluid control applications in semiconductor equipment. This round of fundraising will focus on R&D and industrialization of semiconductor equipment components, accelerating expansion into etching and deposition equipment component markets. As overseas component lead times lengthen, domestic foundries are proactively increasing procurement ratios of domestically made valves. Consequently, Gaoke’s order volume continues expanding—though consistency and service life of its high-end products still require further validation across more production lines. 7. SK Hynix’s next-generation HBM solution adopts Intel’s EMIB packaging technology, driving demand upgrades for advanced packaging equipment On August 26, industry sources reported that SK Hynix’s next-generation HBM products will integrate Intel’s EMIB (Embedded Multi-Die Interconnect Bridge) advanced packaging technology. By doubling the number of through-silicon vias (TSVs), memory bandwidth will be enhanced while power delivery efficiency improved—addressing next-generation AI server compute requirements. This technological evolution will drive upgrades across the full suite of advanced packaging equipment, including hybrid bonding, wafer thinning, dicing, and testing. As HBM technology iterates continuously, equipment precision and signal integrity requirements are further elevated. Overseas equipment vendors hold numerous early orders, while domestic firms—including Changchuan Technology, Jingzhida, and Guangli Technology—are actively developing HBM-compatible equipment and pursuing verification opportunities at memory fabrication lines to narrow the technology gap. 8. Fujifilm invests JPY 7 billion to build new factory; CMP post-CMP cleaning agent capacity triples On August 26, international industry news reported that Fujifilm announced a JPY 7 billion investment to construct a new production facility in Oita City, Japan, dedicated to manufacturing specialized chemical cleaning agents for CMP post-CMP cleaning. Upon completion, production capacity will triple, addressing shortages of consumables driven by global wafer fab expansions. Post-CMP cleaning is an indispensable step following wafer planarization, and cleaning agents directly impact particle and defect control on wafer surfaces. Advanced nodes impose extremely high purity requirements on consumables. Currently, high-end cleaning consumables are dominated by Japanese manufacturers. Continued domestic wafer fab expansion is boosting demand for cleaning consumables, prompting Chinese material suppliers to accelerate R&D and verification of comparable products—and gradually advance domestic substitution. 9. SEMI survey: Global lead times for advanced packaging equipment continue to lengthen; some categories exceed 19 months On August 26, SEMI released its latest supply chain survey data: surging demand from HBM and 3D-Chiplet markets has led to overwhelming orders for advanced packaging equipment globally. Lead times for hybrid bonding, high-end wafer bonding, and HBM test equipment have further extended—with some categories now exceeding 19 months. This supply-chain tightness is expected to persist through 2028. Overseas equipment vendors’ capacity expansion lags behind order growth, prolonging delivery cycles and creating a rare window of opportunity for domestic packaging and test equipment manufacturers. Multiple domestic equipment companies have launched corresponding localized models, though most remain in small-batch verification stages. Large-scale commercial deployment still requires accumulation of yield data from actual production lines.

Fujifilm Invests $18 Million to Expand US Semiconductor CMP Slurry Capacity

Oct 21, 2026

Fujifilm plans to invest approximately $18 million to expand its chemical mechanical polishing slurry production capacity in Mesa, Arizona, targeting supply for AI-driven advanced semiconductor processes by 2027.

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Fujifilm Invests $18 Million to Expand US Semiconductor CMP Slurry Capacity

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