[H-4 Visa + EAD Application Guide] Including Instructions for Filling Out Forms I-539 and I-765

The H-4 visa is a nonimmigrant visa issued by U.S. Citizenship and Immigration Services (USCIS) to immediate family members of H-1B visa holders—typically spouses and unmarried children under age 21. H-4 visa holders may lawfully reside and study in the United States; however, if they wish to work, they must meet specific eligibility requirements to apply for an Employment Authorization Document (EAD). [What Are the Eligibility Requirements for Work Authorization?] H-4 visa holders may apply for an EAD only if one of the following two conditions is met: • The H-1B spouse has received approval of Form I-140: The H-1B holder has initiated the green card process and Form I-140 has been approved; the case is now in the visa bulletin waiting period. In this scenario, the H-4 spouse is eligible to apply for H-4 EAD. • The H-1B spouse is in the post-six-year H-1B extension phase. [H-4 Visa Application Document Checklist] H-4 visa applications fall into two main categories: applications filed outside the U.S. and applications filed while inside the U.S. 1. Applications Filed Outside the U.S. — Document Checklist: • DS-160 form • Passport valid for at least six months beyond the intended stay • Spouse’s Form I-797A (H-1B approval notice) • Photocopies of spouse’s passport information page and visa page • Photocopies of spouse’s Social Security Number (SSN) card and driver’s license • Spouse’s most recent W-2 tax forms • Spouse’s employment contract with employer • Invitation letter (in both Chinese and English) • Original marriage certificate • Visa appointment confirmation page • CITIC Bank visa fee receipt • Visa photographs • Evidence demonstrating the authenticity of the marriage (e.g., joint photographs, phone records, shared bank account statements, etc.) Due to the Trump administration’s suspension of certain nonimmigrant visas—including H, J, and L categories—and its subsequent extensions, issuance of H-1B (skilled worker visas), H-2B (temporary worker visas), H-4 (spouses of H-1B holders), L-1 (intracompany transferee visas), and certain J-1 (exchange visitor visas) was suspended for applications submitted abroad from June 24, 2020, through March 31, 2021. 2. Change of Status Filed Within the U.S. — Document Checklist: • Form I-539 • Form G-1145 (to receive application status updates via SMS or email) • Photocopy of applicant’s passport information page • Photocopy of applicant’s visa page • Applicant’s Form I-94 • Proof of applicant’s current lawful status: e.g., Form I-797A (for H-1B to H-4 change), Form I-20/EAD/transcripts (for F-1 to H-4 change) • Most recent 2–3 pay stubs (if applicable) • Photocopy of spouse’s passport information page • Photocopy of spouse’s visa page • Spouse’s Form I-797A (H-1B approval notice) • Spouse’s Form I-94 • Spouse’s most recent 2–3 pay stubs • Letter of employment verification • Marriage Certificate • Two visa photographs • Check for $370 (I-539 filing fee) + $85 (biometrics fee)

First-round Financing | Fulohua Semiconductor Completes New Round of Funding, with Haiwang Capital Participating

Fulohua Semiconductor was founded in 2018 and is registered in Dongtai City, Jiangsu Province. It is a wholly owned subsidiary of Shanghai Shenhe Investment Co., Ltd., and is an advanced manufacturing enterprise specializing in R&D, production, and sales of power semiconductor copper-clad ceramic substrates—including Active Metal Brazed (AMB), Direct Copper Bonded (DCB), and Direct Plated Copper (DPC) substrates. Leveraging its affiliation with the Ferrotec Group, the company possesses over two decades of experience in DCB substrate manufacturing. It ranks first in China and second globally in production scale, with products meeting international advanced standards. DCB refers to a specialized high-temperature bonding process wherein copper foil is directly bonded to the surface—either single- or double-sided—of ceramic substrates such as aluminum oxide (Al₂O₃) or aluminum nitride (AlN). The resulting ultra-thin composite substrates exhibit excellent electrical insulation, high thermal conductivity, superior soft-solderability, strong adhesion, and high current-carrying capacity. Consequently, DCB substrates have become foundational materials for structural and interconnection technologies in high-power electronic circuits. With over 20 years of industry expertise in ceramic substrate manufacturing, Fulohua serves more than 50 leading domestic and international enterprises. Its domestic market share exceeds 70%, and it ranks second globally—just behind industry leader Rogers Corporation. The company’s technical capabilities are now among the world’s best; product design specifications drafted by Fulode (the parent group) are poised to be officially certified as industry standards. Its products have obtained multiple certifications, including ISO 9001. The Fulohua Semiconductor group includes subsidiaries such as Shanghai Fulohua Semiconductor Technology Co., Ltd., Jiangsu Fulohua Power Semiconductor Research Institute Co., Ltd., and Shanghai Fulohua International Trade Co., Ltd. Its total factory area spans approximately 60,000 square meters, enabling an annual production capacity of up to 18 million power semiconductor copper-clad ceramic substrates. Fulohua Semiconductor has assembled a world-class team of technical experts from Europe, Japan, and China, providing robust technological support for environmentally sustainable semiconductor development. Its R&D team comprises over 30 professionals, and it has established a dedicated Semiconductor Research Institute. With a vision rooted in openness and integration, the institute aims to build diverse, distinctive communities of shared interests and shared destiny—collaborating proactively to confront global challenges.

HB Fuller Sr. VP Heather Campe Files Form 4

Oct 17, 2026

HB Fuller Company reported a Form 4 filing for Sr. VP Heather Campe regarding activity on October 9th. The filing details were not included in the Investing.com article published on October 17, 2026.

Investing.com India

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H.B. Fuller President Acquires Additional 14% Stake

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H.B. Fuller Receives Moderate Buy Consensus from Analysts

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Does H.B. Fuller (FUL) CEO Share Buying Clarify or Complicate Its Margin-Focused Investment Narrative?

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H.B. Fuller VP Receives Phantom Units and Discloses Option, RSU Holdings