[H4 Visa + EAD Application Guide] Including Step-by-Step Instructions for Filing Forms I-539 and I-765

The H-4 visa is a nonimmigrant visa issued by U.S. Citizenship and Immigration Services (USCIS) to immediate family members—typically spouses and unmarried children under age 21—of individuals holding H-1B visas. H-4 visa holders may lawfully reside and study in the United States; however, to work, they must meet specific eligibility criteria for applying for an Employment Authorization Document (EAD). [What Are the Eligibility Requirements for Work Authorization?] An H-4 visa holder may apply for an EAD only if one of the following two conditions is met: • The H-1B spouse has received approval of Form I-140 (Immigrant Petition for Alien Workers): The H-1B spouse has initiated the green card process and the I-140 petition has been approved, placing them in the visa waiting queue; the H-4 spouse is then eligible to apply for H-4 EAD. • The H-1B spouse is in the post-six-year H-1B extension period. [H-4 Visa Application Document Checklist] H-4 visa applications fall into two main categories: applications filed outside the U.S. and applications filed while already inside the U.S. – Applications filed abroad are generally faster, as applicants complete visa interviews, fingerprinting, and adjudication in person at a U.S. consulate or embassy. – Applications filed within the U.S. require mailing documents to USCIS and awaiting approval; typical processing time for a change of status is approximately 6–8 months, but due to pandemic-related backlogs, current wait times are about 18–23 months. 1. Application Filed Abroad – Required Documents: • DS-160 form • Passport valid for at least six months beyond the intended stay • Spouse’s Form I-797A (H-1B approval notice) • Photocopies of spouse’s passport biographical page and visa page • Photocopies of spouse’s Social Security Number (SSN) card and driver’s license • Spouse’s most recent W-2 tax forms • Spouse’s employment contract with their U.S. employer • Invitation letter (in both Chinese and English) • Original marriage certificate • Visa appointment confirmation page • CITIC Bank visa fee receipt • Two visa photographs • Evidence proving the authenticity of the marriage (e.g., joint photographs, call logs, shared bank account statements, etc.) Due to the Trump administration’s suspension of certain nonimmigrant visas—including H-1B (skilled worker), H-2B (temporary worker), H-4 (H-1B dependent), L-1 (intracompany transferee), and certain J-1 (exchange visitor) visas—the issuance of these visas was suspended from June 24, 2020, through March 31, 2021. 2. Change of Status Filed Within the U.S. – Required Documents: • Form I-539 (Application to Extend/Change Nonimmigrant Status) • Form G-1145 (E-Notification of Application/Petition Acceptance) • Photocopy of applicant’s passport biographical page • Photocopy of applicant’s visa page • Applicant’s Form I-94 (Arrival/Departure Record) • Proof of applicant’s current lawful status (e.g., Form I-797A for H-1B-to-H-4 change; Form I-20, EAD, or academic transcripts for F-1-to-H-4 change) • Most recent 2–3 pay stubs (if applicable) • Photocopy of spouse’s passport biographical page • Photocopy of spouse’s visa page • Spouse’s Form I-797A (H-1B approval notice) • Spouse’s Form I-94 • Spouse’s most recent 2–3 pay stubs • Letter of employment verification • Marriage certificate • Two visa photographs • Check for $370 (I-539 filing fee) + $85 (biometrics fee)

First-round Financing | Fulohua Semiconductor Completes New Round of Funding, with Haiwang Capital Participating

Fulohua Semiconductor was founded in 2018 and is headquartered in Dongtai City, Jiangsu Province. It is a subsidiary of Shanghai Shenhe Investment Co., Ltd., and a high-tech manufacturing enterprise specializing in research & development, production, and sales of power semiconductor copper-clad ceramic substrates—including Active Metal Brazed (AMB), Direct Copper Bonded (DCB), and Direct Plated Copper (DPC) substrates. Leveraging its affiliation with the Ferrotec Group, the company brings over two decades of expertise in DCB substrate manufacturing. It ranks first in domestic production capacity and second globally, with products meeting international advanced standards. DCB refers to a specialized high-temperature bonding process wherein copper foil is directly bonded—either on one or both sides—to ceramic substrates made of aluminum oxide (Al₂O₃) or aluminum nitride (AlN). The resulting ultra-thin composite substrates offer excellent electrical insulation, high thermal conductivity, superior soft-solderability, strong adhesion, and high current-carrying capacity—making DCB substrates foundational materials for high-power electronic circuit design and interconnection technologies. With over 20 years of experience in the ceramic substrate industry, Fulohua serves more than 50 renowned domestic and international clients. Its domestic market share exceeds 70%, and it ranks second globally—just behind industry leader Rogers Corporation. The company’s technical capabilities now rank among the world’s best; product design specifications drafted by Fulode (a related entity) are pending certification as official industry standards. Its products have obtained multiple certifications, including ISO 9001. The Fulohua group comprises subsidiaries such as Shanghai Fulohua Semiconductor Technology Co., Ltd., Jiangsu Fulohua Power Semiconductor Research Institute Co., Ltd., and Shanghai Fulohua International Trading Co., Ltd. Its total factory floor area spans approximately 60,000 square meters, enabling annual production capacity of up to 18 million power semiconductor copper-clad ceramic substrates. Fulohua Semiconductor has assembled a world-class R&D team comprising top-tier engineering talent from Europe, Japan, and China, providing robust technical support for environmentally sustainable semiconductor development. Its R&D team numbers over 30 professionals, and it operates a dedicated Semiconductor Research Institute. With a vision rooted in openness and integration, the institute fosters diverse, distinctive communities of shared interest and common destiny—collaborating proactively to meet global technological challenges.