Electronic Adhesives—The Crown Jewel of Adhesive Technology, Driving an Intelligent Future

1. With the rapid development of electronic products toward miniaturization, integration, and portability, demands for thermal conductivity, bonding performance, and specialized functionalities of electronic adhesives are continuously increasing; accordingly, the functional scope of electronic adhesives is becoming increasingly diversified. 2. Based on processing requirements and service performance, underfill adhesives must possess fundamental characteristics such as ease of handling, rapid flow, fast curing, long shelf life, high bond strength, and low modulus—while also meeting requirements for fillability, compatibility, and reworkability. 3. Intensive efforts are underway to develop electrically conductive adhesives exhibiting high conductivity, high bond strength, and high stability under room-temperature curing conditions; to innovate novel conductive fillers; to design and develop new conductive adhesive curing systems; and to formulate flexible conductive adhesives with exceptional adhesion to stretchable substrates and electronic components. 4. Optical display adhesives—beyond basic properties such as high transparency, low haze, refractive index closely matching that of the substrate, and good adhesion—must also satisfy requirements including stable adhesion on curved surfaces, high-flow fillability, dynamic and static bending resistance, and optical enhancement capabilities. 5. Employing high-purity base resins with narrow molecular weight distribution, hybrid spherical fillers combined with specialized toughening technologies, crosslinkers featuring specially designed structures and synthesis methods, and precisely controlled manufacturing processes constitutes the core strategy for enhancing product quality and performance of electronic adhesives. As a critical material in the electronics industry, the development of electronic adhesives is deeply intertwined with technological evolution across downstream sectors—including information electronics, semiconductors, and new energy. Currently, the industry exhibits three major trends: innovation-driven growth, green transformation, and market expansion. Looking ahead, it holds strong potential to achieve dual advancement in scale and quality through technological breakthroughs and broader application deployment. Major Enterprises in the Chinese Electronic Adhesives Industry (listed alphabetically, not by ranking) Henkel (China) Investment Co., Ltd. HOT Henkel Adhesive Technologies leads today’s markets—and shapes tomorrow’s—with adhesives, sealants, and functional coatings. Henkel drives transformation across industries, empowering customers with competitive advantages and delivering unique experiences for consumers. Innovative thinking and pioneering spirit are embedded in Henkel’s DNA. As a global expert in manufacturing industries and applications, Henkel collaborates closely with customers and partners, delivering sustainable value to all stakeholders through trusted brands and highly efficient solutions grounded in its distinctive technology portfolio. Henkel brands include Loctite, Bonderite, Technomelt, Teroson, Aquence, Pritt, Ceresit, and Pattex. Henkel’s adhesive technologies serve automotive and metal, packaging and consumer goods, electronics and industrial, craftsman, construction and professional business sectors. H.B. Fuller (China) Adhesives Co., Ltd. HOT As a globally leading adhesive supplier, H.B. Fuller has focused since 1887 on perfecting adhesives, sealants, and other specialty chemicals—helping customers elevate product quality and improve everyday life. H.B. Fuller is committed to innovative and sustainable adhesive solutions, integrating people, products, and processes to resolve world-class adhesive technology challenges. Its business spans electronics, hygiene materials, healthcare, transportation, aerospace, clean energy, packaging, construction, woodworking, general assembly, and consumer goods markets.

Development of China’s Electronic Adhesives Industry in 2025

Currently, domestic enterprises have achieved competitiveness comparable to international manufacturers in mid-to-low-end application segments, offering electronic adhesives meeting standard specifications at relatively high cost-performance ratios. However, high-end domains—such as chip-level packaging and PCB-level packaging—remain predominantly dominated by foreign companies like Henkel, H.B. Fuller, and Dow Chemical in terms of both technology leadership and market share; consequently, a substantial proportion of domestic downstream enterprises still rely heavily on imports. In recent years, bolstered by national policy support, R&D capabilities and production standards of Chinese electronic adhesives enterprises have continuously improved, revealing a clear trend toward high-end industrial upgrading. Leading domestic firms are progressively strengthening R&D efforts to bridge technological gaps and accelerating their entry into high-end electronic adhesives markets—successfully gaining qualification and inclusion in supply chains of well-known downstream brand customers. 2. Electronic adhesives and downstream technological and process advancements are mutually dependent and mutually reinforcing, characterized by high customization levels and rapid iteration. Given the pivotal role electronic adhesives play in enhancing performance and enabling functionality of electronic components and devices—directly impacting downstream customers’ product functionality, yield rates, production costs, and manufacturing efficiency—the development of electronic adhesives is intrinsically interlinked with and reciprocally promotes progress in electronics industry technologies and processes. On one hand, the performance and features of electronic adhesives are closely tied to their specific application scenarios: different electronic products entail distinct requirements, necessitating that electronic adhesive manufacturers comprehensively consider electrical, chemical, physical, optical, thermal, and process-related properties—based on deep understanding of downstream needs—to formulate tailored adhesive solutions. On the other hand, the swift pace of electronics product upgrades drives rapid iteration of associated technologies and processes, continually imposing new performance and functional demands on electronic adhesives—thus requiring electronic adhesives themselves to evolve continuously in step with downstream industry developments. 3. Rapid rise of domestic enterprises; accelerated domestic substitution of high-end products According to an article published by the China Adhesives & Tape Industry Association, the domestic localization rate of electronic adhesives in China remains below 50%, especially in high-end fields such as semiconductor packaging and PCB-level packaging—where foreign enterprises continue to dominate. The semiconductor packaging segment is estimated to have a domestic localization rate of no more than 10%. In the industry’s early stages, the domestic market was primarily led by foreign brands, and downstream enterprises exhibited strong reliance on imported products. In recent years, domestic enterprises have steadily increased R&D investment, developed diverse raw materials and formulations, and enhanced production technology and testing capabilities—resulting in continuous improvements in product performance and significantly strengthened competitiveness. In certain high-end niche markets, domestic enterprises have already achieved performance metrics matching or even surpassing those of leading international peers, accumulating robust technical expertise, product portfolios, and profitability. 4. Growing global emphasis on environmental protection accelerates development of eco-friendly electronic adhesives With intensifying global societal focus on environmental protection and sustainable development, the environmental attributes of electronic adhesives have become increasingly critical. Numerous countries have enacted directives and standards—such as the Restriction of Hazardous Substances (RoHS) Directive and the Waste Electrical and Electronic Equipment (WEEE) Directive—that impose progressively stricter environmental requirements on electronic adhesives.

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