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    Home > Chemicals Industry > Rubber Plastic News > Heraeus to Present New Solutions for Advanced Packaging and MiniLED Die Bonding at SEMICON China

    Heraeus to Present New Solutions for Advanced Packaging and MiniLED Die Bonding at SEMICON China

    • Last Update: 2022-08-27
    • Source: Internet
    • Author: User
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    (Shanghai, China, March 16, 2021) Heraeus Electronics will exhibit two advanced solder paste products at SEMICON China from March 17-19


    .


    Welco AP519

    Welco AP519

    This No.
    6 powder solder paste is suitable for low temperature processes in SiP, PoP or MiniLED die attach applications


    .


    Welco AP519 T6 solder paste is formulated with Heraeus' proprietary Welco solder powder and is a technologically advanced low temperature no-clean lead-free solder paste


    .


    Welco LED100

    Welco LED100

    This #7 powder solder paste is suitable for ultra-fine pitch MiniLED and die attach applications


    .


    Welco LED100 T7 is a technologically advanced no-clean printed solder paste specially designed for MiniLED chip bonding, suitable for MiniLED backlight and display of TV screens, monitors, tablets, video walls and other equipment


    .


    At present, the Welco LED100 has successfully passed the certification of a leading LED display supplier, and the Welco AP519 has passed the advanced qualification certification of mainstream OSAT and LED display manufacturers


    .


    “Both products are well positioned to address the prevailing trends in the advanced packaging industry, namely the need for miniaturization, thermal management and cost reduction


    .


    While solder paste plays an important role in various industries around the world, the largest manufacturing market for advanced packaging applications is undoubtedly Asia


    .


    At this exhibition, in addition to launching the latest solder paste products, Heraeus Electronics will also showcase more innovative solutions to meet market needs, including: Welco AP5112 solder paste for fine-pitch printing for SiP applications.
    AgCoat Prime gold-plated silver wire, an alternative to gold wire in the memory device, LED and smart card markets, and low temperature pressureless dispensing sintered silver mAgic DA295A for power electronics applications

    .

    At that time, experts from Heraeus will deliver live speeches at the booth (Booth 7535 in Hall E7) to share their cutting-edge thinking on the latest development trends with the audience
    .

    Heraeus

    Finally, for more information on the on-site activities and appointment arrangements of the exhibition, please pay attention to the newly launched Heraeus Electronic WeChat official account
    .

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