echemi logo
Product
  • Product
  • Supplier
  • Inquiry
    Home > Chemicals Industry > China Chemical > How to solve the heat dissipation problem of high-power electronic devices?

    How to solve the heat dissipation problem of high-power electronic devices?

    • Last Update: 2022-05-01
    • Source: Internet
    • Author: User
    Search more information of high quality chemicals, good prices and reliable suppliers, visit www.echemi.com
    [ Star Enterprise of Chemical Machinery Equipment Network ] Chengdu Silicon Treasure Technology Co.
    , Ltd.
    recently added a national invention patent "a single-component temperature-resistant and thermally conductive silica mud composition and its preparation method", patent number: ZL201911342305.
    X, help Solve the heat dissipation problem of electronic devices, especially miniaturized and precision electronic devices
    .
    Up to now, Sibao Technology has 254 international and national patents, including 3 American invention patents and 1 Japanese invention patent!
     
    Chemical Machinery Equipment Net Star Enterprise Chemical Machinery Equipment
    With the rapid growth of the electronic information industry, electronic devices are developing in the direction of miniaturization and precision
    .
    The high-density installation of circuit substrates and electronic components, and the use of high-power modules have put forward higher requirements for solving heat dissipation problems, which have become the key to electronic industry design
    .

     

    In this case, the local temperature of the components can be increased from 80 to 100 °C to 120 to 220 °C.
    Under a long-term high temperature, the thermal conductive silicone grease is easy to dry, causing the thermal conductive interface to be loose and not tight, thereby reducing its thermal conductivity.
    cooling efficiency
    .
    For thermally conductive silicone sheet-like thermal interface materials, the hardness becomes larger after long-term high temperature, resulting in poor interface contact, and at the same time, it is inconvenient to use in heterogeneous heating devices
    .

     

      In response to this problem, Sibao Technology successfully developed "a single-component temperature-resistant and thermally conductive silica mud composition and its preparation method", and applied it to GN300 thermally conductive silica mud and GN500 thermally conductive silica mud, effectively solving the long-term use of the original material.
    The problem of reduced heat dissipation efficiency caused by high temperature
    .

     

      Compared with thermally conductive silicone grease and thermally conductive silicone sheet, Sibao's thermally conductive silicone mud products have the advantages of low volatility, temperature resistance of 120~230°C without drying, etc.
    , which can maintain long-term stability of high temperature heat dissipation efficiency, and have high thermal conductivity.
    , suitable for heat dissipation of electronic component modules with high integration and large heat generation
    .
    Compared with the general-purpose two-component thermally conductive gel, the one-component packaging of Sibao products is very convenient to use.
    At present, this patented technology product has been successfully used in 5G base station components
    .

     

      Technological innovation is an inexhaustible driving force for enterprise development, and it also provides strong support for building a new development pattern and promoting high-quality development.
    As an enterprise in the field of silicone rubber, Silicon Treasure Technology responds to the country's "high-quality development" requirements, market-oriented, Driven by innovation, the annual investment in technology research and development accounts for more than 5% of revenue.
    Relying on innovative platforms such as the National Enterprise Technology Center, we will strengthen technology, improve products, and expand industry, in order to build China into a strong country in silicone technology.
    Work tirelessly
    .

     

      Original title: How to solve the heat dissipation problem of high-power electronic devices?
     

    This article is an English version of an article which is originally in the Chinese language on echemi.com and is provided for information purposes only. This website makes no representation or warranty of any kind, either expressed or implied, as to the accuracy, completeness ownership or reliability of the article or any translations thereof. If you have any concerns or complaints relating to the article, please send an email, providing a detailed description of the concern or complaint, to service@echemi.com. A staff member will contact you within 5 working days. Once verified, infringing content will be removed immediately.

    Contact Us

    The source of this page with content of products and services is from Internet, which doesn't represent ECHEMI's opinion. If you have any queries, please write to service@echemi.com. It will be replied within 5 days.

    Moreover, if you find any instances of plagiarism from the page, please send email to service@echemi.com with relevant evidence.