Issue 13/2016 - High-temperature gels help thermal insulation management of electronic circuits

WACKER HAS INTRODUCED FOR THE FIRST TIME TO THE Chinese market the new silicone thermal conductive filler SEMICOSIL?961TC for the electronics industry, which offers good fluidity and workability and reduces the wear rate of the mixing and metering equipment used, making it an ideal thermal conductive material for thermal connections of electronic circuits and ensuring the efficiency of
thermal management.
In addition, its SEMICOSIL® 915 HT silicone gel can withstand temperatures up to 210°C and is particularly suitable for potting
power electronic components.

SEMICOSIL 961TC is a highly filled, two-component silicone rubber that cures at room temperature with the help of platinum-catalyzed addition reaction into a soft and elastic silicone elastomer with a viscous surface that achieves a thermal conductivity of 2 watts per ( m Kelvin ) while also having electrical insulation properties
.
The shear-thinning properties of SEMICOSIL® 961TC are designed so that silicone rubber can be transferred in the machine without difficulty for linear coating, allowing processors to achieve a high dosage rate and high dosage accuracy
.

When used, the material forms a continuous film that fits tightly to the surface of the two adhesions, resulting in excellent heat dissipation between the electronic circuit and the heat sink
.
The film cures between the adhesions into a silicone coating
.
Even in the presence of frequent temperature changes and vibrations, this soft silicone coating ensures that the component is always morphologically stable
.
In addition, this new filler is suitable for a wide temperature range: its performance can remain unchanged
at -45°C~180°C.
This ability to withstand temperature and temperature changes, as well as to balance vibrations
, is important for applications such as automotive electronics or electric vehicles.

SEMICOSIL 915 HT silicone gel has excellent temperature resistance after crosslinking, and its mechanical properties remain unchanged
for 2000 hours even at 210°C.
This makes it particularly suitable for potting power modules, where these power semiconductor components can withstand high temperatures that conventional silicone materials cannot withstand when used to control high
power.