Issue 13/2017 - New fast-bond adhesives accelerate electronic assembly and increase yield

New fast-bond adhesives accelerate electronic assembly and increase throughput

A few days ago, Dow Corning launched Dow Corning? EA-5151 Quick Bond (QiC) adhesive complements its growing portfolio
of advanced assembly solutions for automotive sensors, advanced driver assistance systems, interior electronics and displays.
The adhesive quickly reaches initial strength at room temperature and is a more efficient alternative
to heat-curing adhesives, double-sided tapes and mechanical fasteners.

The adhesive is a one-component silicone formulation that is heated and used in liquid form by a piston applicator or robotic dispenser, cooled to form a solid viscoelastic material that provides primerless bonding to a variety of substrates, including substrates that are difficult to bond with many alternatives
。 The silicone's immediate initial strength allows assembly parts to be processed immediately after application, minimizing waiting times and reducing energy costs required for heat curing, without the need for assembly aids such as mechanical fasteners and screws; Heated to 120~130 °C within the first 24 hours after application, it can be removed and re-dispensed, making the parts easy to reprocess
.

"As automakers need more displays and sensors to be integrated into vehicles, they need innovative solutions that can assemble these components and systems faster and more cost-effectively while maintaining their high quality standards," said Rogier Reinders, global market director of advanced assembly solutions
at Dow Corning.
EA-5151 Rapid Bond (QiC) adhesive is a great example
of Dow Corning's proactive and collaborative approach to solving technical and business challenges.
Working closely with our customers, we have tailored EA-5151 QiC's new adhesive to meet the need to improve the reliability and performance of the final product and to meet the needs of
Tier 1 global production systems.
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