Issue 23/2015 - Next-generation thermal interface materials help improve the quality of integrated chips

Recently, Dow Corning introduced a new generation of thermal interface materials (TIM 1) - the new Dow Corning TC-3040 thermal gel
.

The TIM-1 solution is a high-purity thermal interface material grade that is applied between the chip surface and the heat sink to dissipate harmful heat to the outside area
of the semiconductor package.
As a variety of applications, from data centers to consumer devices and automotive electronics, require more functional and high-power integrated semiconductor devices, the internal temperature of the chip package can rise rapidly, creating a significant challenge
for traditional TIM-1 solutions.

The partnership between IBM and Dow Corning significantly improved the performance of
the TIM-1 solution.
Dow Corning® TC-3040 thermal conductive gel is nearly twice as
thermally conductive as other industry standard TIMs.
In addition, its thermal conductivity is approximately 4W/mK, which ensures robust reliability and provides chipmakers with a wider range of design options
for producing integrated chips with high performance, high reliability, and significantly improved thermal management systems.
（Chad）