Japan's Toray develops laser transfer release material, which is expected to promote the mass production of Micro LED displays

Japan's Toray Industries, Inc.
announced that, in collaboration with its subsidiary Toray Engineering Co.
, Ltd.
, it has developed a laser-transfer release material that can rapidly align light-emitting diode (LED) chips: this material Simplifies bonding between LEDs and wiring, while helping to expand the substrate sideline material of the display
.
New materials are critical for making microLED displays and improving their performance
.

The Toray Group hopes to advance the advancement and mass production of microLED displays by providing total solutions for various materials and equipment for manufacturing and inspection
.

MicroLED displays offer great potential with their excellent performance and small environmental footprint
.
This is because these advanced devices offer superior brightness, color gamut, contrast ratio and reliability
.
Another benefit is their low power consumption due to the high luminous efficiency of their LEDs
.

The challenge is to come up with techniques to quickly achieve regular arrangements of numerous microLED chips and reduce manufacturing costs sufficiently to drive their widespread adoption
.
New laser transfer material enables rapid placement of large numbers of LED chips anywhere on a substrate during display manufacturing
.

New laser transfer material enables rapid placement of large numbers of LED chips anywhere on a substrate during display manufacturing
.
Combining this material with Toray Engineering's laser transfer and inspection equipment could accelerate the production of microLEDs
.
Displays without color irregularities can also be created by selective placement that reflects the hue of each LED chip
.

The new bonding and substrate sideline materials are the result of further research into RAYBRID  ®  , a proprietary photosensitive conductive material .

The material that connects the LED chip electrodes to the metal traces on the substrate can form joints faster at lower temperatures and reduce bonding forces compared to traditional connection methods
.
As a result, it is easier to replace defective LED chips, which have been a challenge so far, and help improve yields in the manufacturing process
.

The substrate-side wire material transmits the signal from the surface of the substrate to the back of the substrate
.
This simplifies the wiring process and enables seamless arrangement and scaling of multiple displays
.

As such, Toray sought to expand its lineup of materials for microLED displays and combine them with Toray Engineering's manufacturing and inspection equipment
.
This is to provide a total solution for microLED display manufacturing and contribute to the mass manufacturing of microLED displays
.
Toray has mass-produced microLED display materials
.
They include dielectric materials for connecting LED chips, black materials for enhancing display blackness for high contrast, and temporary bonding and debonding materials for thinning or stripping LED chip substrates
.
It aims to expand its lineup with banking materials for more color and superior brightness
.