Sumitomo Bakelite plans to build a semiconductor packaging materials plant

Recently, Japan's Sumitomo Bakelite Co.
, Ltd.
(hereinafter referred to as Sumitomo Bakelite) announced that the company decided to buy land and build a new factory in Suzhou to increase its production capacity
of semiconductor packaging materials.

It is disclosed that the new plant will have an area of about 60,000 square meters and a planned investment of about 6.
6 billion yen, including land, buildings, production lines, and supporting facilities
.
The company plans to complete the installation of buildings and production lines in FY2023 and start production
in FY2024.

Sumitomo Bakelite said that the company's epoxy plastic packaging material "SUMIKON" EME for semiconductor device packaging is currently about 40%
of the global market share.
As a global leader in the field of semiconductor packaging materials, Sumitomo Bakelite invested in the construction of a manufacturing base
in the park in 1995.

Sumitomo Bakelite is a multinational company of the Sumitomo Group listed on the Tokyo Stock Exchange, headquartered in Tokyo, Japan, with 31 factories and research and experimental bases
in 16 countries around the world.