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The advancement of 5G has brought development opportunities to related industries.
For example, in 5G mobile phones, polymer materials with low dielectric, high thermal conductivity and high electromagnetic shielding, such as film materials including PI film, are required
At the "2021 PCB/FPC Application and Development Trend Forum in the New Infrastructure Industry" sponsored by Seek Materials® and co-organized by New Materials Online®, Professor Min Yonggang from the School of Materials and Energy, Guangdong University of Technology introduced high-performance polyamides for 5G communication Market demand and breaking status of amine materials
The polyimide market is growing synchronously with the rapid development of high-end electronic equipment and portable electronic products.
Min Yonggang analyzed that the domestic MPI paste and film preparation technology generally cannot catch up with Japanese, American and Korean companies, and the glue-free copper cladding process is basically controlled by Japanese and American companies
It is understood that the development of the domestic PI industry has some pain points such as lack of domestic R&D experience, weak foundation, lack of PI production technology in domestic enterprises, and weak domestic industrial equipment
Min Yonggang introduced his team's R&D technology route and innovation of polyimide materials for 5G communication
It is understood that the team has developed a biaxially stretched/chemical imidized polyimide film for the raw material of thermally conductive graphite film; developed a 5G high-frequency, low-loss PI film for the raw material of flexible copper clad laminate; Developed CPI glue and CPI film
Min Yonggang said that the team's project is technologically innovative
It is understood that the team's projects such as polyimide resin, polyimide biaxial stretching, and thermal conductive film have been completed.