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Recently, the National Institute of Experimental Research (hereinafter referred to as the "National Research Institute") released the self-power supply technology of the Internet of Things chip, which mainly uses three-dimensional IC technology to develop the stacking and integration of the Internet of Things chip and the ambient light energy collection module to reduce the area of the circuit board, and at the same time allow the Internet of Things device to collect the power supply of the ambient light source by itself.
The National Research Institute pointed out that the Internet of Things chip is highly integrated, which is composed of computing chip, memory, wireless communication, sensor, energy harvesting and storage, independent data processing, storage, signal transmission, and complete the connection
between devices.
The IoT chip can be designed for various sensors such as temperature, smoke, vibration, heartbeat, blood pressure, etc.
, to collect various information, based on different sensor needs, the IoT chip needs to be small, power-saving, and use environmental energy to supplement power to reduce the frequency
of battery replacement charging.
The traditional self-power supply technology of the Internet of Things device is to design the two components of the ambient light acquisition module and the Internet of Things chip on the circuit board, so that the Internet of Things device is larger, the circuit transmission distance is extended, and the use of 3D integrated circuit technology can reduce the circuit board area, while shortening the circuit transmission distance, reducing power consumption, and increasing the practicality
of the Internet of Things chip.
Shen Changhong, head of the prospective component group of the National Nanocomponent Laboratory of the National Academy of Research, said that this technology is cooperating with industry-academia and other research, and currently faces challenges, the photoelectric conversion efficiency of the self-powered technology of the Internet of Things chip is only single digits, and if the photoelectric conversion efficiency can be further improved in the future, the application of the Internet of
Things device will be expanded.
Shen Changhong pointed out that although the photoelectric conversion efficiency needs to be improved, so that the self-powered technology of the Internet of Things chip can not be applied to the design of IoT devices with high power consumption temporarily, there are many different designs of IoT devices, and self-powered technology can be used for IoT devices
with low power consumption.
Recently, the National Institute of Experimental Research (hereinafter referred to as the "National Research Institute") released the self-power supply technology of the Internet of Things chip, which mainly uses three-dimensional IC technology to develop the stacking and integration of the Internet of Things chip and the ambient light energy collection module to reduce the area of the circuit board, and at the same time allow the Internet of Things device to collect the power supply of the ambient light source by itself.
The National Research Institute pointed out that the Internet of Things chip is highly integrated, which is composed of computing chip, memory, wireless communication, sensor, energy harvesting and storage, independent data processing, storage, signal transmission, and complete the connection
between devices.
The IoT chip can be designed for various sensors such as temperature, smoke, vibration, heartbeat, blood pressure, etc.
, to collect various information, based on different sensor needs, the IoT chip needs to be small, power-saving, and use environmental energy to supplement power to reduce the frequency
of battery replacement charging.
The traditional self-power supply technology of the Internet of Things device is to design the two components of the ambient light acquisition module and the Internet of Things chip on the circuit board, so that the Internet of Things device is larger, the circuit transmission distance is extended, and the use of 3D integrated circuit technology can reduce the circuit board area, while shortening the circuit transmission distance, reducing power consumption, and increasing the practicality
of the Internet of Things chip.
Shen Changhong, head of the prospective component group of the National Nanocomponent Laboratory of the National Academy of Research, said that this technology is cooperating with industry-academia and other research, and currently faces challenges, the photoelectric conversion efficiency of the self-powered technology of the Internet of Things chip is only single digits, and if the photoelectric conversion efficiency can be further improved in the future, the application of the Internet of
Things device will be expanded.
Shen Changhong pointed out that although the photoelectric conversion efficiency needs to be improved, so that the self-powered technology of the Internet of Things chip can not be applied to the design of IoT devices with high power consumption temporarily, there are many different designs of IoT devices, and self-powered technology can be used for IoT devices
with low power consumption.