Epoxy curing agent - acid 1

1, benzodiazepine, BTDA, melting point 227 degrees CEach 100 parts of standard resin with 27 to 48 parts, curing: 150 to 200 degrees C 24 hoursThermal deformation temperature 240 to 290 degrees C, bend strength 560 to 700Kg/cm2, impact strength 1.0 to 2.7Kg-/cm2, Lochs hardness 100 to 1172, methyl sub-methyl quadhydrogen phthalates, MNAHT906DQ19128, also known as methyl Nadik anhydride, yellow liquid, viscosity 138cps72 to 90 servings per 100 standard resinsCuring: 100 to 200 degrees C 2-4 hoursApplication period 500 g 25 degrees C5 to 6 days (plus promoter), thermal deformation temperature 150 to 175 degrees C, bend strength 950Kg/cm2, anti-bend strength 1240Kg/cm2, tensile strength 680Kg/cm2, elongation rate 2.5%, impact strength 0 .48ft-1b/in (2.6Kg-cm/cm2), Lochte hardness 111, dielectric constant (50Hz23 oC) 3.6, power factor (50Hz23 oC) 0.002, volume resistance 2x1016 s-cmLow viscosity, good immersion, long service life3, tetrahydrogen phthalated anhydride, THPAHT909RXE-H70 anhydride, melting point 100 degrees C52 to 70 servings per 100 standard resinsCuring: 150 to 200 degrees C 24 hoursLow toxicity, small volatility, good process4, methyl tetrahydrophenyl dyspharides, MTHPASYG-8401HY-905HK-021TCG-1156KZ-5217MCDMHAC, light yellow liquidWeight: 1.21, refractive index: 1.498, viscosity: 50 to 80cps, acid value: 81 to 85The solidification point is less than -15 degrees C and the flash point is larger than 130 degrees C52 to 70 servings per 100 standard resinsCuring: 60 to 70 degrees C, defoaming 100 degrees C 2 hours , 150-200 degrees C 2-10 hours Bendstrength 129.4Mpa, anti-punch strength 18.33KJ/cm2, shear strength 10.59Mpa, bending module 3.175x103Mpa, stretch mode 2.83x103Mpa, thermal deformation temperature of 128 degrees C Breakdown voltage 49KV/mm, media loss 1KC3x10-3, dielectric constant 1KC3.3, volume resistance DC500V85C1.7x1014 Common promoters are pyridine metformin, DMP-30, triethanolamine, 2-ethyl-4 methylmedamine, pyridine, etc., the dosage is 0.2 to 2% 5, the internal methyl tetrahydrophenyl dyspharides, NA647 anhydride, also known as Nadik anhydride, white powder Each 100 parts of standard resin with 80 to 100 6, dipyride, GA, white powder 50 to 80 servings per 100 standard resins 7, polysaccharides, PAPA, white powder Melting point 57 degrees C, every 100 standard resins used 70 to 90 copies Curing: 17 oC for 17 hours 8, dichlorodedebutene dibutylatedic diacidsdys, DCMA, white powder 38 servings per 100 standard resins 9, HCH submethyl tetrahydrophenhyl anhydride, HETHT912CA, also known as chlorin anhydride, chlorbridge anhydride, white powder Melting point 165 degrees C, per 100 parts of standard resin with 100 to 180 copies Curing: 100 degrees C 1 hour and 200 degrees C 1-2 hours The application period is 500 g 120 degrees C for 30 minutes (plus promoter) Thermal deformation temperature 145 to 190 degrees C, bend strength 1150Kg/cm2, anti-pressure strength 1390Kg/cm2, anti-pull strength 820Kg/cm2, elongation rate of 2.6%, impact strength 0.3 to 0.4ft-1b/in, Lochile hardness 111 10, oleic acid, 308, liquid 100-200 servings per 100 standard resins 11, methyl hexahydrophenylatedals, MHHPA, liquid Each 100 standard resins with 70 to 80 parts, curing: 80 degrees C 4 hours and 120 degrees C 4 hours